Inline-type wafer conveyance device
There are comprised a load chamber ( 51 ) for carrying in a wafer from outside, an unload chamber ( 53 ) for carrying out a wafer to outside, and a plurality of conveyance chambers ( 54 a, 54 b, 54 c ) and a plurality of process modules ( 52 a, 52 b ) connected in series between the load chamber and the unload chamber. The conveyance chambers and the process modules are connected alternately and the plurality of conveyance chambers includes a first end conveyance chamber ( 54 a ) connected to the load chamber, a second end conveyance chamber ( 54 c ) connected to the unload chamber, and another one or a plurality of intermediate conveyance chambers ( 54 b ).
1. An inline-type wafer conveyance device comprising:
a load chamber for carrying in a wafer from outside;
an unload chamber for carrying out a wafer to outside; and
a plurality of conveyance chambers and a plurality of process module sets connected in series between the load chamber and the unload chamber, each of the process module sets having a first process module and a second process module capable of independent processing, wherein:
the conveyance chambers and the process module sets are provided alternately;
the plurality of conveyance chambers includes a first end conveyance chamber connected to the load chamber, a second end conveyance chamber connected to the unload chamber, and another one or a plurality of intermediate conveyance chambers;
the first end conveyance chamber conveys a wafer from the load chamber to an initial process module set, each of the intermediate conveyance chambers conveys the wafer between process module sets located ahead and behind thereof, and the second end conveyance chamber conveys the wafer from a last process module set to the unload chamber;
the first and second process modules and the conveyance chamber have substantially a square plane shape; and
the first process module and the second process module have two neighboring side surfaces, respectively, one of the side surfaces of the first process module is connected to one of the side surfaces of a conveyance chamber located ahead via a gate valve, the other side surface of the first process module is connected to one of the side surfaces of a conveyance chamber located behind via a gate valve, one of the side surfaces of the second process module is connected to the other side surface of the conveyance chamber located ahead via a gate valve, and the other side surface of the second process module is connected to the other side surface of the conveyance chamber located behind via a gate valve.
2. An inline-type wafer conveyance device comprising:
a load chamber for carrying in a wafer from outside;
an unload chamber for carrying out a wafer to outside; and
a plurality of conveyance chambers and a plurality of process module sets connected in series between the load chamber and the unload chamber, each of the process module sets having a first process module and a second process module capable of independent processing, wherein:
the conveyance chambers and the process module sets are provided alternately;
the plurality of conveyance chambers includes a first end conveyance chamber connected to the load chamber, a second end conveyance chamber connected to the unload chamber, and another one or a plurality of intermediate conveyance chambers;
the first end conveyance chamber conveys a wafer from the load chamber to an initial process module set, each of the intermediate conveyance chambers conveys the wafer between process module sets located ahead and behind thereof, and the second end conveyance chamber conveys the wafer from a last process module set to the unload chamber;
the first and second process modules and the conveyance chamber have substantially a square plane shape;
the first process module and the second process module have two neighboring side surfaces, respectively, one of the side surfaces of the first process module is connected to one of side surfaces of a conveyance chamber located ahead via a gate valve, the other side surface of the first process module is connected to one of side surfaces of a conveyance chamber located behind via a gate valve, one of the side surfaces of the second process module is connected to the other side surface of the conveyance chamber located ahead via a gate valve, and the other side surface of the second process module is connected to the other side surface of the conveyance chamber located behind via a gate valve; and
in at least one of the process module sets, a buffer chamber is located instead of at least one of the first process module and the second process module, and the buffer chamber is configured so as to be connected to the conveyance chambers located ahead and behind via two gate valves opposite of each other.