Grid node
There is provided a grid node that includes (a) an outer shell made of a non-metal material, (b) an inner shell disposed in the outer shell, and defining a space therebetween, (c) a motherboard in the inner shell, and (d) a multiprotocol antenna array having a connector in communication with the motherboard, where the multiprotocol antenna array is disposed within the space.
1. A grid node comprising:
an outer shell made substantially of a non-metal material;
an inner shell disposed in and enclosed by said outer shell, and defining a space therebetween;
a motherboard in said inner shell; and
a multiprotocol antenna array having a connector in communication with said motherboard, wherein said multiprotocol antenna array is disposed within said space.
2. The grid node of claim 1 , wherein said multiprotocol antenna array further comprises structures that receive and transmit RF signals, wherein said RF signals have a frequency selected from the group consisting of about 700-800 MHz; about 800-950 MHz; about 1850 to about 2000 MHz; about 1570 to about 1580 MHz; about 900 to about 960 MHz; about 2400 to about 2500 MHz; and about 4900 to about 5900 MHz.
3. The grid node of claim 2 , wherein said non-metal material is transparent to said RF signals at said frequency.
4. The grid node of claim 2 , wherein said non-metal material is selected from the group consisting of fiberglass and injection molded plastic.
5. The grid node of claim 2 , wherein said inner shell is opaque to said RF signals at said frequency.
6. The grid node of claim 5 , wherein said inner shell is a conductive material.
7. The grid node of claim 6 , wherein said conductive material is selected from the group consisting of steel, aluminum, and copper.
8. The grid node of claim 2 , wherein said multiprotocol antenna array further comprises a supporting matrix.
9. The grid node of claim 8 , wherein said structures are substantially coplanar with said supporting matrix.
10. The grid node of claim 8 , wherein said structures are substantially perpendicular to said supporting matrix.
11. The grid node of claim 1 , wherein said motherboard further comprises a processor.
12. The grid node of claim 1 , wherein said inner shell further comprises a cover member that substantially encloses and shields said motherboard from RF emissions.
13. The grid node of claim 1 , wherein said motherboard is tolerant of a pulse voltage of 6 kilovolts.
14. The grid node of claim 1 , wherein said structures of said multiprotocol antenna array, without removal of said grid node from a site of installation, receive and transmit RF signals having a frequency selected from the group consisting of about 700-800 MHz; about 800-950 MHz; about 1850 to about 2000 MHz; about 1570 to about 1580 MHz; about 900 to about 960 MHz; about 2400 to about 2500 MHz; and about 4900 to about 5900 MHz.
15. The grid node of claim 1 , wherein said multiprotocol antenna array comprises:
a first antenna for transmitting and receiving signals in a first frequency band; and
a second antenna for transmitting and receiving signals in a second frequency band.
16. The grid node of claim 15 , wherein each of said first antenna and said second antenna is omnidirectional.
17. The grid node of claim 15 , wherein said first antenna and said second antenna have at least 20 decibels of RF isolation therebetween.
18. A method of constructing a grid node, comprising:
providing an outer shell made substantially of a non-metal material;
disposing an inner shell made of a conductive material in and enclosed by said outer shell and forming a space therebetween;
positioning a motherboard having a processor and a memory in said inner shell; and
positioning an antenna array in communication with said motherboard in said space.
19. The method of claim 18 , wherein said antenna array is a multiprotocol integrated antenna array.
20. The method of claim 18 , wherein said antenna array comprises:
a first antenna for transmitting and receiving signals in a first frequency band; and
a second antenna for transmitting and receiving signals in a second frequency band.
21. The method of claim 20 , wherein each of said first antenna and said second antenna is omnidirectional.
22. The method of claim 20 , wherein said first antenna and said second antenna have at least 20 decibels of RF isolation therebetween.
23. A grid node comprising:
an outer shell made substantially of a non-metal material;
an inner shell disposed in and enclosed by said outer shell, and defining a space therebetween;
a motherboard in said inner shell;
a first antenna communicatively coupled to said mother board via a first connector, for transmitting and receiving signals in a first frequency band; and
a second antenna communicatively coupled to said mother board via a second connector, for transmitting and receiving signals in a second frequency band,
wherein said first antenna and said second antenna are disposed within said space.
24. The grid node of claim 23 , wherein each of said first antenna and said second antenna is omnidirectional.
25. The grid node of claim 23 , wherein said first antenna and said second antenna have at least 20 decibels of RF isolation therebetween.