Methods of forming p-channel field effect transistors having SiGe source/drain regions
View Patent ↗Methods of forming p-channel MOSFETs use halo-implant steps that are performed relatively early in the fabrication process. These methods include forming a gate electrode having first sidewall spacers thereon, on a semiconductor substrate, and then forming a sacrificial sidewall spacer layer on the gate electrode. A mask layer then patterned on the gate electrode. The sacrificial sidewall spacer layer is selectively etched to define sacrificial sidewall spacers on the first sidewall spacers, using the patterned mask layer as an etching mask. A PFET halo-implant of dopants is then performed into portions of the semiconductor substrate that extend adjacent the gate electrode, using the sacrificial sidewall spacers as an implant mask. Following this implant step, source and drain region trenches are etched into the semiconductor substrate, on opposite sides of the gate electrode. These source and drain region trenches are then filled by epitaxially growing SiGe source and drain regions therein.
1. A method of forming a p-channel MOSFET, the method comprising:
forming a gate electrode having first sidewall spacers thereon, on a semiconductor substrate;
forming a sacrificial sidewall spacer layer on the gate electrode;
patterning a mask layer on the sacrificial sidewall spacer layer;
selectively etching the sacrificial sidewall spacer layer to define sacrificial sidewall spacers on the first sidewall spacers, using the patterned mask layer as an etching mask;
performing a PFET halo-implant into portions of the semiconductor substrate extending adjacent the gate electrode, using the sacrificial sidewall spacers as an implant mask; then
etching source and drain region trenches into the semiconductor substrate, adjacent opposite sides of the gate electrode;
filling the source and drain region trenches by epitaxially growing SiGe source and drain regions therein;
selectively removing the sacrificial sidewall spacers from sidewalls of the gate electrode; and
implanting source and drain region dopants into the SiGe source and drain regions, using the gate electrode and the first sidewall spacers as an implant mask.
2. The method of claim 1 , wherein the first sidewall spacers comprise a nitride material; and wherein forming a sacrificial sidewall spacer layer on the gate electrode comprises depositing a sacrificial oxide layer on the gate electrode.
3. The method of claim 1 , wherein selectively removing the sacrificial sidewall spacers from sidewalls of the gate electrode comprises exposing the sacrificial sidewall spacers to a hydrofluoric acid solution.
4. The method of claim 1 , wherein performing a PFET halo-implant comprises performing a PFET halo-implant into portions of the semiconductor substrate extending adjacent the gate electrode, using the patterned mask layer and the sacrificial sidewall spacers as an implant mask.
5. The method of claim 1 , wherein implanting source and drain region dopants comprises both horizontal and vertical implanting.
6. A method of forming p-channel MOSFETs, the method comprising:
forming first and second gate electrodes extending in orthogonal directions relative to each other, on a semiconductor substrate;
forming first and second sidewall spacers on the first and second gate electrodes, respectively;
forming a sacrificial sidewall spacer layer on the first and second gate electrodes;
patterning a mask layer on the first and second gate electrodes;
selectively etching the sacrificial sidewall spacer layer to define sacrificial sidewall spacers on the first and second sidewall spacers, using the patterned mask layer as an etching mask;
performing a quad rotation PFET halo-implant into portions of the semiconductor substrate extending adjacent the first and second gate electrodes, using the patterned mask layer as an implant mask; then
etching source and drain region trenches into the semiconductor substrate, adjacent opposite sides of the first and second gate electrodes;
filling the source and drain region trenches by epitaxially growing SiGe source and drain regions therein;
selectively removing the sacrificial sidewall spacers from sidewalls of the first and second gate electrodes; and
implanting source and drain region dopants into the SiGe source and drain regions, using the first and second gate electrodes and the first and second sidewall spacers as an implant mask.
7. The method of claim 6 , wherein implanting source and drain region dopants comprises both horizontal and vertical implanting.
8. The method of claim 6 , wherein the first and second sidewall spacers comprise a nitride material; and wherein forming a sacrificial sidewall spacer layer on the first and second gate electrodes comprises depositing a sacrificial oxide layer on the first and second gate electrodes.
9. The method of claim 6 , wherein selectively removing the sacrificial sidewall spacers comprises exposing the sacrificial sidewall spacers to a hydrofluoric acid solution.
10. A method of forming p-channel MOSFETs having SiGe source and drain regions, comprising:
forming first and second gate electrodes extending in orthogonal directions relative to each other, on a semiconductor substrate;
patterning a mask layer on the first and second gate electrodes;
performing a quad rotation PFET halo-implant into portions of the semiconductor substrate extending adjacent the first and second gate electrodes, using the patterned mask layer as an implant mask; then
etching source and drain region trenches into the semiconductor substrate, adjacent opposite sides of the first and second gate electrodes;
filling the source and drain region trenches by epitaxially growing SiGe source and drain regions therein; and
implanting source and drain region dopants into the SiGe source and drain regions, using the first and second gate electrodes as an implant mask.
11. The method of claim 10 , wherein implanting source and drain region dopants comprises both horizontal and vertical implanting.