Semiconductor light-emitting device
View Patent ↗Disclosed is a semiconductor light-emitting device including a package having a light outlet, a semiconductor laser diode disposed in the package and radiating a light having a first wavelength falling within a range of ultraviolet ray to visible light, and a visible-light-emitter containing a phosphor which absorbs a light radiated from the semiconductor laser diode and emits a visible light having a second wavelength differing from the first wavelength, the visible-light-emitter being disposed on an optical path of the laser diode and a peripheral edge of the visible-light-emitter being in contact with the package.
1. A semiconductor light-emitting device comprising:
a package having a light outlet;
a semiconductor laser diode disposed in the package and radiating a light having a first wavelength falling within a range of ultraviolet ray to visible light; and
a visible-light-emitter containing a phosphor which absorbs a light radiated from the semiconductor laser diode and emits a visible light having a second wavelength differing from the first wavelength, said visible-light-emitter being disposed on an optical path of the laser diode and a peripheral edge of the visible-light-emitter being in contact with the package,
wherein the visible-light-emitter has a contour of a rectangular configuration, a polygonal configuration or an elliptical configuration, each having an aspect ratio of not less than 2:1, and a longer axis of a cross-sectional shape of a light emitted from the laser diode is the same in direction with a longer axis of the contour of the visible-light-emitter.
2. The device according to claim 1 , wherein the visible-light-emitter contains at least one kind of phosphor particles which are dispersed in transparent resin, inorganic glass or crystal.
3. The device according to claim 1 , wherein the visible-light-emitter is formed of a sintered phosphor.
4. The device according to claim 1 , further comprising a transparent plate-like or lens-like structure composed of glass, metal or resin, which is disposed on an outside of and in contact with the visible-light-emitter.
5. A semiconductor light-emitting device comprising:
a package having a light outlet;
a semiconductor laser diode disposed in the package and radiating a light having a first wavelength falling within a range of ultraviolet ray to visible light, the semiconductor laser diode being held, through its top and bottom surfaces, between a couple of heat sinks each having a tapered structure; and
a visible-light-emitter containing a phosphor which absorbs a light radiated from the semiconductor laser diode and emits visible light having a second wavelength differing from the first wavelength, said visible-light-emitter being disposed on an optical path of the semiconductor laser diode.
6. The device according to claim 5 , wherein one of said couple of heat sinks is connected with the semiconductor laser diode by means of solder or conductive pastes, or is thermally connected with the semiconductor laser diode through a metallic thick film which is adhered on a surface of said one of said couple of heat sinks which is connected to the semiconductor laser diode, and another heat sink is secured by a spring-like spacer disposed between said another heat sink and the package.
7. The device according to claim 5 , wherein the package includes a bottom component and a cap component, and surfaces of these bottom component and cap component which face an optical path of the light emitted from the semiconductor laser diode are provided with a first mirror which reflects visible light and near ultraviolet ray, and a tapered surface of each of the heat sinks is formed of a second mirror.
8. The device according to claim 5 , wherein said couple of heat sinks are held, through its top and bottom surfaces, by the package, at least the surface of which is formed of an insulating metal or ceramics.
9. The device according to claim 5 , wherein the visible-light-emitter is disposed in the package in which a peripheral edge of the visible-light-emitter is in contact with the package.
10. The device according to claim 9 , wherein the visible-light-emitter has a contour of a rectangular configuration, a polygonal configuration or an elliptical configuration, each having an aspect ratio of not less than 2:1, and a longer axis of a cross-sectional shape of a light emitted from the laser diode is the same in direction with a longer axis of the contour of the visible-light-emitter.
11. The device according to claim 5 , wherein the visible-light-emitter contains at least one kind of phosphor particles which are dispersed in transparent resin, inorganic glass or crystal.
12. The device according to claim 5 , wherein the visible-light-emitter is formed of a sintered phosphor.
13. The device according to claim 5 , further comprising a transparent plate-like or lens-like structure composed of glass, metal or resin, which is disposed on an outside of and in contact with the visible-light-emitter.
14. The device according to claim 1 , wherein the package includes a bottom component and a cap component, and surfaces of these bottom component and cap component which face an optical path of the light emitted from the semiconductor laser diode are provided with a mirror which reflects visible light and near ultraviolet ray.
15. The device according to claim 1 , wherein the visible-light-emitter contains the phosphor at a content of 5-75% by weight.
16. The device according to claim 5 , wherein the package includes a bottom component and a cap component, and surfaces of these bottom component and cap component which face an optical path of the light emitted from the semiconductor laser diode are provided with a mirror which reflects visible light and near ultraviolet ray.
17. The device according to claim 5 , wherein the visible-light-emitter contains the phosphor at a content of 5-75% by weight.