RF power module
View Patent ↗A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.
1. An electronic device including a power amplifier circuit for transmitting a transmitting radio frequency (RF) signal, which is for use in a communication device,
the electronic device comprising:
a wiring board having a top surface and a bottom surface opposite each other;
a first semiconductor chip including a switch circuit capable of switching between transmission and reception of RF signals, mounted over the top surface of the wiring board;
a second semiconductor chip including a power amplifier circuit, a first control circuit controlling the switch circuit and a second control circuit controlling the power amplifier circuit, mounted over the top surface of the wiring board;
a plurality of external connection terminals disposed over the bottom surface of the wiring board; and
a seal resin sealing the first semiconductor chip and the second semiconductor chip,
wherein the second semiconductor chip has a rectangular plane shape having four sides, and
wherein the first semiconductor chip is positioned on a line orthogonal to one of the four sides of the second semiconductor chip in a plan view.
2. An electronic device according to claim 1 ,
wherein the communication device has an antenna for receiving and transmitting RF signals, and
wherein the switch circuit operates so as to transmit the transmitting RF signal from the power amplifier circuit to the antenna in a transmission period.
3. An electronic device according to claim 1 ,
wherein the communication device has an antenna for receiving and transmitting RF signals,
wherein the communication device has a low noise amplifier (LNA) which is capable of amplifying a receiving RF signal, and
wherein the switch circuit operates so as to receive the receiving RF signal from the antenna to the LNA in a reception period.
4. An electronic device according to claim 1 ,
wherein a low pass filter is coupled between the switch circuit and the power amplifier circuit.
5. An electronic device according to claim 1 ,
wherein the switch circuit is comprised of a High Electron Mobility Transistor (HEMT).
6. An electronic device according to claim 1 ,
wherein the second semiconductor chip includes a bias circuit for applying a bias voltage to the power amplifier circuit.
7. An electronic device according to claim 1 ,
wherein a via hole is formed in the wiring board beneath the second semiconductor chip, and
wherein a conductive film is filled in the via hole.
8. An electronic device according to claim 1 ,
wherein a passive component is disposed over the top surface of the wiring board.
9. A radio frequency (RF) module including a power amplifier circuit for transmitting a transmitting RF signal, the RF module comprising:
a wiring board having a top surface and a bottom surface opposite each other;
a first semiconductor chip including a switch circuit capable of switching between transmission and reception of RF signals, mounted over the top surface of the wiring board;
a second semiconductor chip including a power amplifier circuit, a first control circuit controlling the switch circuit and a second control circuit controlling the power amplifier circuit, mounted over the top surface of the wiring board;
a plurality of external connection terminals disposed over the bottom surface of the wiring board; and
a seal resin sealing the first semiconductor chip and the second semiconductor chip,
wherein the second semiconductor chip has a rectangular plane shape having four sides, and
wherein the first semiconductor chip is positioned on a line orthogonal to one of the four sides of the second semiconductor chip in a plan view.
10. An RF module according to claim 9 ,
wherein the RF module is for use in a mobile communication device,
wherein the mobile communication device has an antenna for receiving and transmitting RF signals, and
wherein the switch circuit operates so as to transmit the transmitting RF signal from the power amplifier circuit to the antenna in a transmission period.
11. An RF module according to claim 9 ,
wherein the RF module is for use in a mobile communication device,
wherein the mobile communication device has an antenna for receiving and transmitting RF signals,
wherein the communication device has a low noise amplifier (LNA) which is capable of amplifying a receiving RF signal, and
wherein the switch circuit operates so as to receive the receiving RF signal from the antenna to the LNA in a reception period.
12. An RF module according to claim 9 ,
wherein a low pass filter is coupled between the switch circuit and the power amplifier circuit.
13. An RF module according to claim 9 ,
wherein the switch circuit is comprised of a High Electron Mobility Transistor (HEMT).
14. An RF module according to claim 9 ,
wherein the second semiconductor chip includes a bias circuit for applying a bias voltage to the power amplifier circuit.
15. An RF module according to claim 9 ,
wherein a via hole is formed in the wiring board beneath the second semiconductor chip, and
wherein a conductive film is filled in the via hole.
16. An RF module according to claim 9 ,
wherein a passive component is disposed over the top surface of the wiring board.