Liquid crystal display panel, liquid crystal display device having the same, and method of manufacturing the same

1. A liquid crystal display panel, comprising:

a first substrate including a plurality of first electrodes and a second substrate including a plurality of second electrodes formed opposite to each other to sandwich a liquid crystal layer, wherein

a first terminal that is linearly formed and a second terminal that is linearly formed for electrically connecting either the first electrodes or the second electrodes is formed on either the second substrate or the first substrate;

the first terminal is longer than the second terminal;

connection pad portions are disposed to face the first and second terminals respectively, are connected to either the first electrode or the second electrode and are formed on either the first substrate or the second substrate, wherein the connection pad portions have a bonding part that is formed wider than other regions thereof; and

the bonding part is formed on the same layer as the connection pad portion.

2. The liquid crystal display panel according to claim 1 , wherein either of the first substrate and the second substrate having the first and second terminals formed thereon has a size greater than a size of the other substrate.

3. The liquid crystal display panel according to claim 1 , further comprising a conductive connecting portion formed between the first and second substrates to connect either the first electrodes or the second electrodes to the first and second terminals.

4. A liquid crystal display device comprising:

a liquid crystal display panel provided on a circuit board, the liquid crystal display panel having a first substrate including a plurality of first electrodes and a second substrate including a plurality of second electrodes formed opposite to each other to sandwich a liquid crystal layer;

a first terminal and a second terminal formed on either the second substrate or the first substrate to connect either the first electrodes or the second electrodes electrically; and

connection pad portions disposed to face the first and second terminals respectively, connected to either the first electrode or the second electrode, and formed on either the first substrate or the second substrate, wherein the connection pad portion have a bonding part that is formed wider than other regions thereof, wherein

the bonding part is formed on a same layer as the connection pad portion;

the first terminal is linearly formed and the second terminal is linearly formed;

the first terminal is longer than the second terminal; and

the first and second terminals and the circuit board are electrically connected to each other.

5. The liquid crystal display device according to claim 4 , wherein the first and second terminals and the circuit board are connected using wire bonding.

6. The liquid crystal display device according to claim 4 , wherein either of the first substrate and the second substrate having the first and second terminals formed thereon has a size greater than a size of the other substrate.

7. The liquid crystal display device according to claim 4 , further comprising a conductive connecting portion formed between the first and second substrates to connect either the first electrodes or the second electrodes to the first and second terminals.

8. A liquid crystal display device comprising:

a plurality of liquid crystal display panels stacked one over another and disposed on a circuit board, the liquid crystal display panels having a first substrate including a plurality of first electrodes and a second substrate including a plurality of second electrodes formed opposite to each other to sandwich a liquid crystal layer;

a first terminal and a second terminal formed on either the second substrate or the first substrate of each liquid crystal display panel to connect either the first electrodes or the second electrodes electrically; and

connection pad portions disposed to face the first and second terminals respectively, connected to either the first electrode or the second electrode and formed on either the first substrate or the second substrate, wherein the connection pad portion have a bonding part that is formed wider than other regions thereof, wherein

the bonding part is formed on a same layer as the connection pad portion

the first terminal is linearly formed and the second terminal is linearly formed;

the first terminal is longer than the second terminal; and

the first and second terminals of each liquid crystal display panel and the circuit board are electrically connected to each other.

9. The liquid crystal display device according to claim 8 , wherein the first and second terminals and the circuit board are connected using wire bonding.

10. The liquid crystal display device according to claim 8 , wherein either of the first substrate and the second substrate having the first and second terminals formed thereon has a size greater than a size of the other substrate.

11. A method of manufacturing a liquid crystal display device, comprising the steps of:

forming a plurality of first electrodes and a first terminal that is linearly formed a second terminal that is linearly formed electrically isolated from the first electrodes on a first substrate and forming a plurality of second electrodes and connection pad portions connected to the second electrode on a second substrate, wherein the first terminal is longer than the second terminal, and the connection pad portions have a bonding part that is formed wider than other regions thereof, and the bonding part is formed on a same layer as the connection pad portion;

electrically connecting the second electrodes and the first and second terminals with the first electrodes and the second electrodes disposed to face each other and the first and second terminals and the connection pad portions disposed to face each other; and

electrically connecting the first and second terminals to a circuit board.

12. The method according to claim 11 , wherein the first and second terminals and the second electrodes are electrically connected by a bonding material at an end of each of the second electrodes.

13. The method according to claim 12 , wherein the bonding material is a soldering material.

14. The method according to claim 13 , wherein the soldering material includes any of Sn, Ag, and Bi.

15. The method according to claim 11 , wherein the first and second terminals and the circuit board is connected using wire bonding.

16. The method according to claim 11 , wherein the first substrate having the first and second terminals formed thereon is formed greater than the second substrate.

17. A method of manufacturing a liquid crystal display device, comprising the steps of:

forming a plurality of first electrodes and a first terminal that is linearly formed and a second terminal that is linearly formed electrically isolated from the first electrodes on a first substrate and forming a plurality of second electrodes and connection pad portions connected to the second electrode on a second substrate, wherein the first terminal is longer than the second terminal and the connection pad portions have a bonding part that is formed wider than other regions thereof, and the bonding part is formed on a same layer as the connection pad portion;

combining the first substrate and the second substrate such that the first electrodes and the second electrodes face each other and the first and second terminals and the connection pad portions face each other and electrically connecting the second electrodes and the first and second terminals to fabricate a liquid crystal display panel; and

stacking a plurality of the liquid crystal display panels one over another and disposing them on a circuit board and electrically connecting the first and second terminals of each of the plurality of liquid crystal display panels to the circuit board.

18. The method according to claim 17 , wherein the first and second terminals and the second electrodes are electrically connected by a bonding material at an end of each of the second electrodes.

19. The method according to claim 17 , wherein the first and second terminals and the circuit board is connected using wire bonding.

20. The method according to claim 17 , wherein the first substrate having the first and second terminals formed thereon is formed greater than the second substrate.