Spacer-connector and circuit board assembly
A spacer-connector and connection arrangements between daughter boards and motherboards are disclosed. Assemblies may include a daughter board one or more spacer-connectors spacing the daughter board above a motherboard and conductive elastomers providing electrical connections between the daughter board and spacer-connector and between the spacer-connector and the motherboard. The spacer-connector may include ground, power, digital and/or controlled impedance RF pathways to conduct signals between the daughter board to the mother board.
1. A circuit board assembly comprising:
a spacer-connector assembly positioned between a first circuit board and a second circuit board, wherein the spacer-connector assembly comprises:
a spacer-connector formed of a multilayer printed circuit board (PCB) having a configurable pad array that is configured to pass signals between the first circuit board and the second circuit board, wherein the pad array is formed from the surface conductive layer of the PCB; and
an elastomeric conductive interface positioned between the pad array of at least one of the spacer-connector and the first circuit board or the spacer-connector and the second circuit board; and
a pressure component configured to provide a homogeneous pressure across the elastomeric conductive interface of the spacer-connector assembly, wherein the spacer-connector includes multiple parallel ground planes and impedance controlled conductive vias.
2. The circuit board assembly of claim 1 , wherein the elastomeric conductive interface is formed of a material that is conductive under a characteristic pressure.
3. The circuit board assembly of claim 2 , wherein the characteristic pressure is a range of pressures for a given material.
4. The circuit board assembly of claim 2 , wherein the elastomeric conductive interface is at least one of a spray-on material, a conductive sheet or a high density compressible material that becomes conductive in vertical paths under pressure.
5. The circuit board assembly of claim 1 , wherein the impedance controlled conductive vias each comprise a conductive via adjacent to a plurality of ground vias.
6. The circuit board assembly of claim 5 , wherein impedance controlled conductive vias includes at least one fully differential via set.
7. The circuit board assembly of claim 1 , wherein the pad array is formed of pads on a top and bottom surface of the PCB coupled to conductive vias formed through the PCB.
8. The circuit board assembly of claim 1 , wherein the pressure component comprises:
a stiffener block located over the spacer-connector and coupled to the first circuit board and the second circuit board provide the homogeneous pressure.
9. The circuit board assembly of claim 8 , wherein the stiffener block is formed of metal with a surface contacting the first circuit board being insulated.
10. The circuit board assembly of claim 8 , wherein the stiffener block is coupled to the first circuit board and the second circuit board via a resilient fastener system.
11. The circuit board assembly of claim 1 , wherein the pressure component includes a metal insert grounded to provide electrical shielding and reduce induced current.
12. The circuit board assembly of claim 1 , wherein the pressure component is a resilient fastener system directly applied to the first circuit board to fasten the first circuit board to the second circuit board and compress the spacer-connector assembly in between with a relatively constant pressure.
13. The circuit board assembly of claim 1 , wherein the first circuit board is a daughter board coupled to a device under test, and wherein the second circuit board is a mother board.
14. A circuit board assembly comprising:
a spacer-connector assembly positioned between a first circuit board and a second circuit board, wherein the spacer-connector assembly comprises:
a spacer-connector formed of a multilayer printed circuit board (PCB) having a configurable pad array that is configured to pass signals between the first circuit board and the second circuit board, wherein the pad array is formed from the surface conductive layer of the PCB; and
an elastomeric conductive interface positioned between the pad array of at least one of the spacer-connector and the first circuit board or the spacer-connector and the second circuit board; and
a pressure component configured to provide a homogeneous pressure across the elastomeric conductive interface of the spacer-connector assembly, wherein the pad array is formed of pads on a top and bottom surface of the PCB coupled to conductive vias formed through the PCB, and
wherein pad array comprises pads coupled to impedance controlled conductive vias, conductive vias and ground vias.
15. The circuit board assembly of claim 14 , wherein at least a portion of the pad array is arranged in at least one of a ground/signal/ground arrangement or ground/signal/signal/ground arrangement.
16. A circuit board assembly comprising:
a spacer-connector assembly positioned between a first circuit board and a second circuit board, wherein the spacer-connector assembly comprises:
a spacer-connector formed of a multilayer printed circuit board (PCB) having a configurable pad array that is configured to pass signals between the first circuit board and the second circuit board, wherein the pad array is formed from the surface conductive layer of the PCB; and
an elastomeric conductive interface positioned between the pad array of at least one of the spacer-connector and the first circuit board or the spacer-connector and the second circuit board; and
a pressure component configured to provide a homogeneous pressure across the elastomeric conductive interface of the spacer-connector assembly,
wherein the first circuit board is a daughter board coupled to a device under test, and wherein the second circuit board is a mother board and
wherein the spacer-connector has a second pad array and wherein the two pad arrays are positioned toward opposite ends of the daughter board to form a cavity below a portion of the daughter board coupled to the device under test.
17. The circuit board assembly of claim 16 , further comprising:
at least one electrical component positioned in the cavity.
18. The circuit board assembly of claim 17 , wherein the at least one electrical component is a radio frequency (RF) tuning component coupled to at least one of the daughter board or the mother board.
19. The circuit board assembly of claim 16 , further comprising:
a cable connection coupled to a portion of the daughter board in the cavity.