Target utilization improvement for rotatable magnetrons
Rotatable magnetron sputtering apparatuses are described for depositing material from a target while reducing premature burn through issues. The rotatable magnetron sputtering apparatus includes electric coils wound on pole pieces to modulate the magnetic fields at the ends of the magnetron magnetic assembly. Changing the direction of electric current moves the sputtering region alternately around its normal central position to decrease the rate of erosion depth at the ends of the target material.
1. A sputtering apparatus, comprising;
an elongated magnetic assembly, comprising:
a first set of magnets disposed toward a central portion of the magnetic assembly, each magnet of the first set of magnets having a first magnetic orientation;
a second set of magnets disposed toward an outer portion of the magnetic assembly, each magnet of the second set of magnets having a second magnetic orientation that is opposite to the first magnetic orientation; and
one or more electromagnetic coils between the first and second sets of magnets, the one or more electromagnetic coils wound around one or more pole pieces, the one or more electromagnetic coils configured to provide a switchable magnetic field having a third magnetic orientation that is parallel to one of the first and second magnetic orientations and opposite to the other of the first and second magnetic orientations, wherein the one or more electromagnetic coils are disposed at end portions of the elongated magnetic assembly.
2. The sputtering apparatus of claim 1 , wherein the one or more electromagnetic coils are arranged in an approximately curved fashion along a sputtering path at each end of the magnetic assembly.
3. The sputtering apparatus of claim 1 , wherein the first and third magnetic orientations are parallel.
4. The sputtering apparatus of claim 1 , wherein the second and third magnetic orientations are parallel.
5. The sputtering apparatus of claim 1 , wherein the first set of magnets comprises a plurality of magnets.
6. The sputtering apparatus of claim 1 , wherein the second set of magnets comprises a plurality of magnets.
7. The sputtering apparatus of claim 1 , further comprising one or more magnetic field-shaping pole pieces disposed on top of the one or more pole pieces.
8. The sputtering apparatus of claim 1 , wherein one or more of the first and second sets of magnets comprise permanent magnets.
9. The sputtering apparatus of claim 1 , wherein the second set of magnets circumscribes at least a portion of the first magnet.
10. The sputtering apparatus of claim 1 , wherein the first set of magnets has a length that is larger than a width of the first set of magnets.
11. The sputtering apparatus of claim 1 , wherein the second set of magnets has a length that is larger than a width of the second set of magnets.
12. The sputtering apparatus of claim 1 , wherein the magnetic assembly comprises 5 or more electromagnetic coils at each end of the magnetic assembly.
13. The sputtering apparatus of claim 1 , wherein the first and second sets of magnets are oriented along a longitudinal axis of the elongated magnetic assembly.
14. The sputtering apparatus of claim 1 , wherein the one or more electromagnetic coils are substantially disposed at end portions of the magnetic assembly.
15. A cylindrical rotatable magnetron sputtering apparatus, comprising:
an elongated magnetic assembly having one or more electromagnetic coils between a first set of magnets and a second set of magnets, the one or more electromagnetic coils configured to provide a switchable magnetic field having a magnetic orientation that is parallel to the magnetic orientation of one of the first and second sets of magnets and opposite the magnetic orientation of the other of the first and second sets of magnets, wherein the one or more electromagnetic coils are disposed at end portions of the elongated magnetic assembly;
one or more insulated wires in electric contact with the one or more electromagnetic coils, the one or more insulated wires configured to provide electric current to the one or more electromagnetic coils; and
a backing tube for housing the magnetic assembly, the backing tube configured to hold a target material,
wherein the backing tube is configured to rotate while the magnetic assembly remains stationary.
16. The cylindrical rotatable magnetron sputtering apparatus of claim 15 , wherein the one or more electromagnetic coils are substantially disposed at end portions of the magnetic assembly.
17. The cylindrical rotatable magnetron sputtering apparatus of claim 15 , wherein the first and second sets of magnets are oriented along a longitudinal axis of the elongated magnetic assembly.
18. A cylindrical rotatable magnetron sputtering device, comprising:
an elongated magnetic assembly having a first set of electromagnetic coils and a second set of electromagnetic coils, each of the first and second sets of electromagnetic coils disposed between a first set of magnets and a second set of magnets, each of the first and second sets of electromagnetic coils configured to provide a switchable magnetic field having a magnetic orientation that is parallel to the magnetic orientation of one of the first and second sets of magnets and opposite the magnetic orientation of the other of the first and second sets of magnets, wherein the first set of electromagnetic coils are disposed at an end portion of the elongated magnetic assembly and the second set of electromagnetic coils are disposed at an opposing end portion of the elongated magnetic assembly;
one or more insulated wires in electric contact with the first and second sets of electromagnetic coils, the one or more insulated wires configured to provide electric current to each of the first and second sets of electromagnetic coils; and
a backing tube for housing the magnetic assembly, the backing tube configured to hold a target material.
19. The cylindrical rotatable magnetron sputtering device of claim 18 , wherein the backing tube is configured to rotate while the magnetic assembly remains stationary.
20. The cylindrical rotatable magnetron sputtering device of claim 18 , further comprising a plurality of insulated wires, wherein a first subset of the plurality of insulated wires is in electric contact with the first set of electromagnetic coils, and wherein a second subset of the plurality of insulated wires is in electric contact with the second set of electromagnetic coils.
21. The cylindrical rotatable magnetron sputtering device of claim 20 , wherein each of the first subset and the second subset of the plurality of insulated wires is in electric contact with a separate power supply.
22. The cylindrical rotatable magnetron sputtering device of claim 18 , wherein the one or more insulated wires include a pair of wires separately connected in parallel to the first and second sets of electromagnetic coils.
23. The cylindrical rotatable magnetron sputtering device of claim 18 , wherein the one or more insulated wires include pairs of wires, each of the pairs of wires being connected to one of the first set and second set of electromagnetic coils.
24. The cylindrical rotatable magnetron sputtering device of claim 23 , wherein each of the pairs of wires is in electric contact with a separate power supply.
25. The cylindrical rotatable magnetron sputtering device of claim 18 , wherein each of the first and second sets of electromagnetic coils are substantially disposed at end portions of the magnetic assembly.
26. The cylindrical rotatable magnetron sputtering device of claim 18 , wherein the first and second sets of magnets are oriented along a longitudinal axis of the elongated magnetic assembly.