Semiconductor device and semiconductor device manufacturing method
View Patent ↗A semiconductor device includes a pair of electromagnetically coupled inductors. Each of the inductors is comprised of a plurality of through electrodes which extend through a semiconductor substrate, and wires which connect the plurality of through electrodes in series.
1. A semiconductor device comprising a pair of electromagnetically coupled inductors, each of said inductors including a plurality of through electrodes which extend through a semiconductor substrate, and wires which connect said plurality of through electrodes in series.
2. The semiconductor device according to claim 1 , further comprising a magnetic core which serves as a magnetic core for said pair of inductors.
3. The semiconductor device according to claim 2 , wherein said magnetic core is comprised of a plurality of partial magnetic core segments.
4. The semiconductor device according to claim 2 , comprising a plurality of said magnetic cores.
5. The semiconductor device according to claim 2 , wherein said magnetic core and said through electrodes are formed of the same magnetic material.
6. The semiconductor device according to claim 3 , wherein said magnetic core and said through electrodes are formed of the same magnetic material.
7. The semiconductor device according to claim 4 , wherein said magnetic core and said through electrodes are formed of the same magnetic material.
8. The semiconductor device according to claim 5 , wherein said magnetic core and said through electrodes are formed of nickel.
9. The semiconductor device according to claim 6 , wherein said magnetic core and said through electrodes are formed of nickel.
10. The semiconductor device according to claim 7 , wherein said magnetic core and said through electrodes are formed of nickel.
11. The semiconductor device according to claim 2 , further comprising a magnetic element arranged around said pair of inductors.
12. The semiconductor device according to claim 3 , further comprising a magnetic element arranged around said pair of inductors.
13. The semiconductor device according to claim 4 , further comprising a magnetic element arranged around said pair of inductors.
14. The semiconductor device according to claim 5 , further comprising a magnetic element arranged around said pair of inductors.
15. The semiconductor device according to claim 6 , further comprising a magnetic element arranged around said pair of inductors.
16. The semiconductor device according to claim 11 , wherein said magnetic element is connected to said magnetic core.
17. The semiconductor device according to claim 11 , wherein said magnetic core, said through electrodes, and said magnetic element are formed of the same magnetic material.
18. The semiconductor device according to claim 17 , wherein said magnetic core, said through electrodes, and said magnetic element are formed of nickel.
19. The semiconductor device according to claim 2 , wherein at least part of one of said pair of inductors is disposed within circumference formed by the other inductor.