IP Library Granted Patent US 7,986,405
Granted Patent B2
US 7,986,405 · App. 12/758,363 · Granted Jul 26, 2011

Foreign matter inspection method and foreign matter inspection apparatus

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,986,405
App. No.
12/758,363
Granted
Jul 26, 2011
Kind
B2
Abstract

In a foreign matter inspection apparatus comprising: irradiating unit for irradiating inspection light to an inspection area of an article to be inspected; intensity detecting unit for detecting intensity of either reflected light or scattered light, which is generated from the inspection area by irradiating thereto the inspection light; position detecting unit for detecting a position of either the reflected light or the scattered light within the inspection area; and deciding unit for deciding whether or not a foreign matter is present within the inspection area; the foreign matter inspection apparatus is comprised of: display unit capable of displaying thereon both a threshold image in which the threshold value is indicated over an entire area of the inspection area, and a detection sensitivity image indicated by being converted from the threshold image.

Claims (26)

1. An inspection apparatus which inspects a substrate comprising:

an irradiating unit for irradiating inspection light on an inspection area of said substrate;

a detecting unit for detecting scattered light from said substrate;

a first processing unit which calculates a threshold value;

a second processing unit which inspects a foreign matter of said substrate based on said threshold value; and

a first display unit which displays a distribution image of said threshold value on said substrate,

wherein said first processing unit calculates a standard deviation based on said inspection area, and calculates said threshold value by multiplying a coefficient by said standard deviation.

2. An inspection apparatus according to claim 1 ,

wherein said first processing unit calculates said standard deviation by overlapping a plurality of images of a plurality of inspection areas.

3. An inspection apparatus according to claim 1 , further comprising,

a third processing unit which makes a detection sensitivity image of said distribution image.

4. An inspection apparatus according to claim 3 , further comprising,

a second display unit which displays said detection sensitivity image of said threshold value.

5. A method for inspecting a substrate comprising:

an irradiating step of irradiating an inspection light on an inspection area of said substrate;

a detecting step of detecting light from said substrate;

a first processing step which calculates a threshold value;

a second processing step which inspects a foreign matter of said substrate based on said threshold value; and

a first display step which displays a distribution image of said threshold value on said substrate,

wherein in said first processing step a standard deviation is calculated based on said inspection area, and said threshold value is calculated by multiplying a coefficient by said standard deviation.

6. The method according to claim 5 ,

wherein in said first processing step said standard deviation is calculated by overlapping a plurality of images of a plurality of inspection areas.

7. The method according to claim 5 , further comprising,

a third processing step of making a detection sensitivity image of said distribution image.

8. The method according to claim 7 , further comprising,

a second display step of displaying said detection sensitivity image of said threshold value.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →