Dual frequency low temperature oxidation of a semiconductor device
Methods and apparatus for forming an oxide layer on a semiconductor substrate are disclosed. A two frequency plasma source is used to form a plasma in a plasma reactor. In various embodiments, different quantities of power are supplied to a power source operating at the first frequency and a power source operating at the second frequency over time.
1. A method of forming an oxide layer on a stack on a semiconductor substrate by low temperature plasma oxidation, comprising:
placing the semiconductor substrate on a substrate support in a chamber of a plasma reactor;
introducing a gas into the chamber, the gas consisting essentially of oxygen and an optional second gas selected from hydrogen, helium, argon, krypton, neon and xenon;
supplying power to a power source operating at a first frequency to generate a first plasma containing ionized oxygen within the chamber;
supplying power to a power source operating at a second frequency, wherein the second frequency is higher than the first frequency; and
growing the oxide layer at a temperature below 700° C. on the stack on the semiconductor substrate by oxidizing the stack including a pair of sidewalls and the power supplied at the first frequency and the second frequency is selected to provide sufficient energy to cover the sidewalls and to prevent damage to the semiconductor substrate, wherein the oxide layer is formed in a first step in which no power is supplied at the first frequency while power is supplied at the second frequency and in a second step in which power is supplied at the first frequency and the second frequency.
2. The method of claim 1 , wherein the power source operating at the first frequency is a separate power source from the power source operating at the second frequency.
3. The method of claim 1 , wherein the power source operating at the first frequency is the same power source as the power source operating at the second frequency.
4. The method of claim 3 , further comprising dividing the power between a first power applicator to generate a plasma at the first frequency and a second power applicator to generate a plasma at the second frequency.
5. The method of claim 4 , wherein both the first and second power applicators comprise a coil antenna.
6. The method of claim 4 , wherein both the first and second power applicators comprise a hollow cathode.
7. The method of claim 1 , further comprising maintaining power at the second frequency at a substantially constant power during forming the oxide layer.
8. The method of claim 1 , wherein more power is supplied at the second frequency than is supplied at the first frequency.
9. The method of claim 1 , wherein the power supplied at the first frequency is substantially constant during forming the oxide layer.
10. The method of claim 1 , wherein the power supplied at the first frequency and at the second frequency remains substantially constant during the second step.
11. The method of claim 1 , wherein the process is used to form an oxide layer on a gate electrode including a pair of sidewalls and oxide layer is formed while power at the first frequency is gradually increased and substantially constant power is supplied at the second frequency.
12. The method of claim 1 , wherein the process is used to form an oxide layer on a gate electrode including a pair of sidewalls and the power supplied at the second frequency is substantially constant and power supplied at the first frequency is ramped at a targeted rate to increase growth of oxide on the sidewalls.
13. The method of claim 1 , wherein the first frequency operates in the range of about 10 kHz and 14 MHz.
14. The method of claim 13 , wherein the second frequency operates in the range of about 1 MHz and 5 GHz.
15. The method of claim 1 , wherein the plasma chamber comprises an apparatus selected from an RF inductive plasma apparatus, a radial-line slot antenna plasma apparatus, and a hollow cathode plasma apparatus.
16. The method of claim 1 , further comprising varying at least one of the power to the power source, the first frequency and the second frequency.
17. The method of claim 16 , wherein varying one or both of the power to the power source, the first frequency and the second frequency occurs during separate steps.
18. A method of forming an oxide layer on a stack on a semiconductor substrate by low temperature plasma oxidation, comprising:
placing the semiconductor substrate on a substrate support in a chamber of a plasma reactor;
introducing a gas into the chamber, the gas consisting essentially of oxygen and an optional second gas selected from hydrogen, helium, argon, krypton, neon and xenon;
supplying power to a power source operating at a first frequency to generate a first plasma containing ionized oxygen within the chamber;
supplying power to a power source operating at a second frequency, wherein the second frequency is higher than the first frequency; and
growing the oxide layer at a temperature below 700° C. on the stack on the semiconductor substrate by oxidizing the stack including a pair of sidewalls and the power supplied at the first frequency and the second frequency is selected to provide sufficient energy to cover the sidewalls and to prevent damage to the semiconductor substrate, wherein the oxide layer is formed in a first step in which no power is supplied at the first frequency while power is supplied at the second frequency followed by a second step in which power at the first frequency is gradually increased and substantially constant power is supplied at the second frequency followed by a third step in which substantially constant power is supplied at the first frequency and the second frequency.
19. The method of claim 18 , wherein the power source operating at the first frequency is a separate power source from the power source operating at the second frequency.
20. The method of claim 18 , wherein the power source operating at the first frequency is the same power source as the power source operating at the second frequency.
21. The method of claim 20 , further comprising dividing the power between a first power applicator to generate plasma at the first frequency and a second power applicator to generate a plasma at the second frequency.
22. The method of claim 21 , wherein both the first and second power applicators comprise a coil antenna.
23. The method of claim 21 , wherein both the first and second power applicators comprise a hollow cathode.
24. The method of claim 18 , further comprising maintaining power at the second frequency at a substantially constant power during forming the oxide layer.
25. The method of claim 18 , wherein more power is supplied at the second frequency than is supplied at the first frequency.
26. The method of claim 18 further comprising varying at least one of the power to the power source, the first frequency and the second frequency.