Image sensing device having thin thickness

1. An image sensing device, comprising:

an image sensing chip having a front surface, and the front surface defining an image sensing region thereon;

an optical module, comprising:

a barrel directly disposed on the front surface and around the image sensing region; and

at least a transparent element disposed in the barrel and facing to the image sensing region; and

a protecting element covering an area of the front surface outside the optical module and surrounding the barrel;

wherein the barrel has a top surface, and the protecting element extends to cover a portion of the top surface of the barrel.

2. The image sensing device as claimed in claim 1 , wherein the protecting element is composed of a molding compound.

3. The image sensing device as claimed in claim 2 , wherein the protecting element is composed of an epoxy molding compound.

4. The image sensing device as claimed in claim 2 , wherein the protecting element extends to cover a plurality of side walls of the image sensing chip.

5. The image sensing device as claimed in claim 1 , wherein the protecting element is a guarding ring sleeved on the barrel.

6. The image sensing device as claimed in claim 5 , wherein material of the protecting element is selected from a group consisting of metal, plastic and ceramic.

7. The image sensing device as claimed in claim 5 , wherein the protecting element is adhered to the barrel and the image sensing chip through an adhesive.

8. The image sensing device as claimed in claim 1 , wherein the barrel is adhered to the front surface through an adhesive.

9. The image sensing device as claimed in claim 1 , wherein an orthogonal projection area of the optical module on the front surface is less than an area of the front surface and is more than an area of the image sensing region.

10. The image sensing device as claimed in claim 1 , wherein the image sensing region comprises a plurality of light sensitive units arranged in an array and a plurality of color filter patterns corresponding to the light sensitive units, and the color filter patterns are respectively disposed on the light sensitive units.

11. The image sensing device as claimed in claim 10 , wherein the image sensing region further comprises a plurality of micro lenses corresponding to the color filter patterns, and the micro lenses are respectively disposed on the color filter patterns.

12. The image sensing device as claimed in claim 10 , wherein the color filter patterns comprises a plurality of red filter patterns, a plurality of green filter patterns and a plurality of blue filter patterns.

13. The image sensing device as claimed in claim 1 , wherein the image sensing chip is a front side illumination CMOS image sensing chip.

14. The image sensing device as claimed in claim 1 , wherein the image sensing chip is a back side illumination CMOS image sensing chip.

15. The image sensing device as claimed in claim 1 , further comprising a substrate, wherein the image sensing chip is disposed on a supporting surface of the substrate and is electrically connected to the substrate.

16. The image sensing device as claimed in claim 15 , wherein the image sensing chip comprises a plurality of through silicon vias, and the image sensing chip is electrically connected to the substrate through the through silicon vias.

17. The image sensing device as claimed in claim 15 , wherein the substrate comprises a plurality of electrically connecting portions disposed on a rear surface opposite to the supporting surface.

18. The image sensing device as claimed in claim 1 , wherein the optical module is a lens module, and the transparent element includes at least a lens.