IP Library Granted Patent US 9,133,375
Granted Patent B2
US 9,133,375 · App. 12/770,342 · Granted Sep 15, 2015

Epoxy-paste adhesives resistant to wash-off

Inventors: David Sturgill (Brookfield, WI); Scott L. Hartsell (Troy, MI); Jeng-Li Liang (Auburn Hills, MI); Rajat K. Agarwal (Brighton, MI)
Assignee: Henkel AG & Co. KGaA
C09J163/00C08K5/0008C08L33/20
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Quick Facts
Patent No.
US 9,133,375
App. No.
12/770,342
Granted
Sep 15, 2015
Kind
B2
Abstract

This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-curable epoxy-based adhesive compositions that are resistant to being washed off substrate surfaces prior to being cured. The incorporation of a solid diene-based rubber, in particular an acrylonitrile-butadiene copolymer rubber having a relatively high Mooney viscosity, significantly enhances the wash-off resistance of the adhesive, while still allowing the adhesive to be readily dispensed by pumping under high shear conditions.

Claims (19)

1. A pumpable and wash-off resistant epoxy paste adhesive comprising: A) at least one epoxy resin; B) from 1 to 8 weight %, based on the total weight of the epoxy paste adhesive, of at least one solid diene-based rubber, wherein the solid diene-based rubber does not take the form of a core/shell particle where a central core is surrounded by an outer shell having a different composition than the core and wherein the solid diene-based rubber is comprised of from 25 to 35 weight percent acrylonitrile and 65 to 75 weight percent butadiene; C) at least one heat-activated latent curing agent; and D) at least one impact modifier/toughening agent selected from the group consisting of epoxy-based prepolymers obtained by reacting one or more amine-terminated polymers with one or more epoxy resins.

2. The epoxy paste adhesive of claim 1 wherein said at least one solid diene-based rubber has a Mooney viscosity of from 50 to 100 at 100 degrees C. as measured by ASTM D-1646 (Method B-002).

3. The epoxy paste adhesive of claim 1 wherein said at least one solid diene-based rubber is crosslinked.

4. The epoxy paste adhesive of claim 1 additionally comprising one or more of: at least one thixotropic agent/rheology modifier; at least one heat-activated blowing agent; at least one impact modifier/toughening agent other than the at least one impact modifier/toughening agent selected from the group consisting of epoxy-based prepolymers obtained by reacting one or more amine-terminated polymers with one or more epoxy resins; or at least one inorganic filler.

5. The epoxy paste adhesive of claim 1 comprising at least one substituted guanidine heat-activated latent curing agent.

6. The epoxy paste adhesive of claim 1 additionally comprising at least one inorganic particulate additive selected from the group consisting of calcium oxide and calcium carbonate.

7. The epoxy paste adhesive of claim 1 wherein the at least one epoxy resin includes at least one polyglycidyl ether of a polyphenol and at least one polyglycidyl ether of a non-aromatic polyalcohol.

8. The epoxy paste adhesive of claim 1 comprising from about 30 to about 65 weight percent of epoxy resin.

9. The epoxy paste adhesive of claim 1 comprising from about 25 to about 60 weight percent epoxy resin and about 0.5 to about 10 weight percent heat-activated latent curing agent.

10. The epoxy paste adhesive of claim 1 , wherein said at least one solid diene-based rubber is crosslinked.

11. The epoxy paste adhesive of claim 1 , additionally comprising at least one anti-stringing agent.

12. The epoxy paste adhesive of claim 11 , wherein the at least one anti-stringing agent is a mixture of amorphous silica and fibrillated polyethylene fibers.

13. The epoxy paste adhesive of claim 1 , wherein the at least one epoxy resin includes at least one epoxy resin selected from the group consisting of diglycidyl ethers of bisphenol A and bisphenol F.

14. The epoxy paste adhesive of claim 1 , wherein the at least one solid diene-based rubber includes at least one solid diene-based rubber having a Mooney viscosity of at least 25 and not more than 100 at 100 degrees C. as measured by ASTM D-1646 (Method B-002).

15. A method of making the epoxy paste adhesive of claim 1 , comprising preparing a preblend of the at least one solid diene-based rubber and epoxy resin and combining the preblend with other components of the epoxy paste adhesive.

16. The method of claim 15 , wherein the preblend additionally includes a particulate inorganic filler.

17. A method of increasing wash-off resistance of an epoxy paste adhesive comprised of at least one epoxy resin, and at least one impact modifier/toughening agent selected from the group consisting of epoxy-based prepolymers obtained by reacting one or more amine-terminated polymers with one or more epoxy resins, and at least one heat-activated latent curing agent, said method comprising incorporating into said epoxy paste adhesive from 1 to 8 weight percent, based on the total weight of the epoxy paste adhesive, of one or more solid diene-based rubbers, wherein the solid diene-based rubbers do not take the form of a core/shell particle where a central core is surrounded by an outer shell having a different composition than the core and wherein the solid diene-based rubber is comprised of from 25 to 35 weight percent acrylonitrile and 65 to 75 weight percent butadiene.

18. The method of claim 17 , wherein the at least one anti-stringing agent is a mixture of amorphous silica and fibrillated polyethylene fibers.

19. The method of claim 17 , wherein said at least one solid diene-based rubber has a Mooney viscosity of from 50 to 100 at 100 degrees C. as measured by ASTM D-1646 (Method B-002).

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2015
From: STURGILL, DAVID A.; HARTSELL, SCOTT L.; LIANG, JENG-LI; AGARWAL, RAJAT K.
To: HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN
Reel/Frame 036150/0262 →
CHANGE OF NAME Recorded Jul 22, 2015
From: HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN
To: HENKEL AG & CO. KGAA
Reel/Frame 036150/0785 →
Continuity (3)
Continuation PCTUS2008012264 · Oct 29, 2008
Provisional Application 60983748 · Oct 30, 2007
Related Publication 20100272908A1 · Oct 28, 2010