IP Library › Granted Patent US 8,144,469
Granted Patent B2
US 8,144,469 · App. 12/775,654 · Granted Mar 27, 2012

Processor loading system

Assignee: Dell Products L.P.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,144,469
App. No.
12/775,654
Filed
May 7, 2010
Granted
Mar 27, 2012
Kind
B2
Art Unit
2835
USPC
361/704
Abstract

A component loading system includes a board having a socket, wherein the board includes a first mounting member and a pair of first heat dissipater coupling posts that extend from the board adjacent the socket. A base member defines two base member securing holes, wherein the base member is secured to the board using the pair of first heat dissipater coupling posts such that a first heat dissipater coupling post extends through each base member securing hole. A loading member includes a pair of second heat dissipater coupling posts extending from the loading member, wherein the loading member is operable to be secured to the board by coupling the loading member to the base member and securing the loading member to the board using the first mounting member, and wherein a heat dissipater is operable to be coupled to the base member and the loading member using the pair of first heat dissipater coupling posts and the pair of second heat dissipater coupling posts. The component loading system couples a component to the socket while using less board space and volume next to the board than conventional loading systems in order to provide for, for example, increased trace routing volume and closer component positioning adjacent the socket.

Claims (34)

1. A component loading system, comprising:

a board comprising a socket, wherein the board includes a first mounting member and a pair of first heat dissipater coupling posts that extend from the board adjacent the socket;

a base member that defines two base member securing holes, wherein the base member is secured to the board using the pair of first heat dissipater coupling posts such that a first heat dissipater coupling post extends through each base member securing hole; and

a loading member that includes a pair of second heat dissipater coupling posts extending from the loading member, wherein the loading member is operable to be secured to the board by coupling the loading member to the base member and securing the loading member to the board using the first mounting member, and wherein a heat dissipater is operable to be coupled to the base member and the loading member using the pair of first heat dissipater coupling posts and the pair of second heat dissipater coupling posts.

2. The system of claim 1 , wherein loading member is operable to be moveably coupled to the base member.

3. The system of claim 1 , wherein the first mounting member extends through a first mounting hole that is defined by the board adjacent the socket, and the pair of first heat dissipater coupling posts extend through a pair of second mounting holes that are defined by the board adjacent the socket.

4. The system of claim 1 , wherein the pair of first heat dissipater coupling posts and the pair of second heat dissipater coupling posts are operable to couple to threaded fasteners.

5. The system of claim 1 , further comprising:

a plurality of traces located on the board and coupled to the socket.

6. The system of claim 1 , further comprising:

a heat producing component that is operable to be mated with the socket.

7. The system of claim 6 , wherein loading member is operable to apply a force to the heat producing component sufficient to mate the heat producing component with the socket when the heat producing component is positioned on the socket and the loading member is secured to the board.

8. The system of claim 7 , wherein the heat dissipation device is operable to be thermally coupled to the heat producing component when the heat producing component is mated with the socket and the heat dissipation device is coupled to the base member and the loading member.

9. An information handling system, comprising:

a chassis housing a board that comprises a socket and includes a first mounting member and a pair of first heat dissipater coupling posts that extend from the board adjacent the socket;

a processor coupled to the socket, wherein the processor is mated to the socket with a processor loading system comprising:

a base member that defines two base member securing holes, wherein the base member is secured to the board using the pair of first heat dissipater coupling posts such that a first heat dissipater coupling post extends through each base member securing hole;

a loading member that includes a pair of second heat dissipater coupling posts extending from the loading member, wherein the loading member is secured to the board to mate the processor to the socket by a coupling between the loading member and the base member and a coupling between the loading member and the first mounting member; and

a heat dissipater coupled to the base member and the loading member using the pair of first heat dissipater coupling posts and the pair of second heat dissipater coupling posts such that the heat dissipater is thermally coupled the processor.

10. The system of claim 9 , further comprising:

a plurality of traces located on the board and coupled to the socket.

11. The system of claim 9 , wherein the coupling between the loading member and the base member comprises a moveable coupling.

12. The system of claim 9 , wherein the first mounting member extends through a first mounting hole that is defined by the board adjacent the socket, and the pair of first heat dissipater coupling posts extend through a pair of second mounting holes that are defined by the board adjacent the socket.

13. The system of claim 9 , wherein the pair of first heat dissipater coupling posts and the pair of second heat dissipation coupling posts are operable to couple to threaded fasteners.

14. The system of claim 9 , wherein loading member applies a force to the processor that is sufficient to mate the processor to the socket when the loading member is secured to the board.

15. A method for coupling a processor to a socket, comprising:

providing a board that comprises a socket and includes a first mounting member and a pair of first heat dissipater coupling posts that extend from the board adjacent the socket, wherein a base member that defines two base member securing holes is secured to the board using the pair of first heat dissipater coupling posts such that a first heat dissipater coupling post extends through each base member securing hole;

positioning a processor adjacent the socket;

coupling a loading member to the base member and securing the loading member to the board using the first mounting member, wherein the coupling and securing provides a force on the processor sufficient to mate the processor to the socket; and

coupling a heat dissipater to the base member using the pair of first heat dissipater coupling posts, and coupling the heat dissipater to the loading member using a pair of second heat dissipater coupling posts that extend from the loading member.

16. The method of claim 15 , wherein coupling the loading member to the base member comprises moveably coupling the loading member to the base member.

17. The method of claim 15 , wherein the first mounting member extends through a first mounting hole that is defined by the board adjacent the socket, and the pair of first heat dissipater coupling posts extend through a pair of second mounting holes that are defined by the board adjacent the socket.

18. The method of claim 15 , wherein the pair of first heat dissipater coupling posts and the pair of second heat dissipater coupling posts are operable to couple to threaded fasteners.

19. The method of claim 15 , wherein a plurality of traces are located on the board and coupled to the socket.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040040/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0618 →
RELEASE OF SECURITY INTEREST Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLANT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0216 →
PATENT SECURITY AGREEMENT (ABL) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031898/0001 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031899/0261 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jan 2, 2014
From: APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 031897/0348 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2010
From: KYLE, LAWRENCE ALAN; REGIMBAL, LAURENT A.
To: DELL PRODUCTS L.P.
Reel/Frame 024352/0576 →
Continuity (1)
Related Publication 20110273842A1 · Nov 10, 2011