Apparatus and method for predetermined component placement to a target platform
The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.
1. A system for aligning electrical contacts of a second electronic circuit or assembly with electrical contacts of a first electronic circuit or assembly, the first electronic circuit or assembly and the second electronic circuit or assembly each being provided with alignment features, comprising:
a placement mechanism for placing electrical contacts of the second electronic circuit or assembly in contact or near contact with electrical contacts of the first electronic circuit or assembly;
a sensing mechanism for, during said contact or near contact, electrically sensing an alignment condition of alignment features of the second electronic circuit or assembly and alignment features of the first electronic circuit or assembly to obtain sensing information, and for storing the sensing information; and
a controller coupled to the placement mechanism and the sensing mechanism for analyzing said sensing information to determine a movement to be caused between the second electronic circuit or assembly and the first electronic circuit or assembly to achieve an improved alignment condition;
wherein each of the alignment features comprises a plurality of alignment elements, and wherein the sensing mechanism is configured to electrically sense an alignment condition of alignment elements of an alignment feature of the second electronic circuit or assembly and alignment elements of an alignment feature of the first electronic circuit or assembly.
2. The apparatus of claim 1 , wherein the controller is configured to control the placement mechanism for, following said sensing, moving the second electronic circuit or assembly to achieve an improved alignment condition.
3. The apparatus of claim 1 , wherein the sensing mechanism comprises:
a probe arrangement having a plurality of sensor elements; and
circuitry for dynamically configuring the probe arrangement to select a subset of the sensor elements for sensing the alignment condition.
4. The apparatus of claim 3 , wherein the first electronic circuit or assembly is held stationary, further comprising a probe arrangement alignment mechanism for, prior to using the probe arrangement to electrically sense an alignment condition, aligning the probe arrangement in relation to the first electronic circuit or assembly.
5. The apparatus of claim 1 , comprising circuitry for applying an electrical stimulus to an alignment feature, wherein the probe arrangement is configured to electrically sense presence or absence of the electrical stimulus.
6. The apparatus of claim 5 , wherein the probe arrangement is configured to perform resistive sensing.
7. The apparatus of claim 5 , wherein the probe arrangement is configured to perform capacitive sensing.
8. The apparatus of claim 5 , comprising circuitry for applying an electrical stimulus in parallel to multiple alignment features.
9. The apparatus of claim 5 , comprising circuitry for applying an electrical stimulus in series to multiple alignment features.
10. The apparatus of claim 5 , wherein the placement mechanism comprises a database, the database having prestored therein dimensional information pertaining to an alignment feature.