Laminated electronic component and manufacturing method therefor
A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a first plating layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant at least on a surface of the first plating layer and on a section in the external surface of the component main body at which an end edge of the first plating layer is located, and then forming a second plating layer on the first plating layer having the water repellant applied thereon.
1. A method for manufacturing a laminated electronic component, the method comprising the steps of:
preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body; and
forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes; wherein
the step of forming the external terminal electrode includes the steps of:
forming a first plating layer on exposed surfaces of the internal electrodes in the component main body;
applying a water repellant at least on a surface of the first plating layer and on a section of the external surface of the component main body at which an end edge of the first plating layer is located; and then
forming a second plating layer on the first plating layer having the water repellant applied thereon.
2. The method for manufacturing a laminated electronic component according to claim 1 , wherein the step of forming the external terminal electrode further includes the step of subjecting the component main body having the first plating layer formed thereon to a heat treatment, between the step of forming the first plating layer and the step of applying the water repellant.
3. The method for manufacturing a laminated electronic component according to claim 1 , wherein the step of forming the first plating layer includes the step of forming a plating layer primarily including copper, and the step of forming the second plating layer includes the step of forming a plating layer primarily including nickel and subsequently the step of forming a plating layer primarily including tin or gold.
4. The method for manufacturing a laminated electronic component according to claim 1 , wherein
the component main body has a substantially rectangular parallelepiped shape having a pair of principal surfaces opposed to each other, a pair of side surfaces opposed to each other, and a pair of end surfaces opposed to each other, the internal electrodes being at least partially exposed at the end surfaces; and
in the step of forming the first plating layer, the first plating layer is formed on the end surfaces such that end edges of the first plating layer are located on the principal surfaces and the side surfaces, which are adjacent to the end surfaces.
5. A laminated electronic component comprising:
a component main body having a laminated structure, the component main body including a plurality of internal electrodes provided therein, and the internal electrodes each being partially exposed on an external surface of the component main body; and
an external terminal electrode arranged on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes; wherein
the external terminal electrode includes a first plating layer provided on exposed surfaces of the internal electrodes of the component main body, a second plating layer provided on the first plating layer, and a water repellent film provided between the first plating layer and the second plating layer.
6. The laminated electronic component according to claim 5 , wherein an interdiffusion layer is provided in a region in the internal electrode with a length of about 2 μm or more from a boundary of the first plating layer.
7. The laminated electronic component according to claim 5 , wherein the first plating layer includes a plating layer primarily including copper, and the second plating layer includes a plating layer primarily including nickel and a plating layer thereon primarily including tin or gold.
8. The laminated electronic component according to claim 5 , wherein
the component main body has a substantially rectangular parallelepiped shape including a pair of principal surfaces opposed to each other, a pair of side surfaces opposed to each other, and a pair of end surfaces opposed to each other, the internal electrodes being at least partially exposed at the end surfaces; and
the first plating layer is arranged on the end surfaces such that end edges of the first plating layer are located on the principal surfaces and the side surfaces, which are adjacent to the end surfaces.