IP Library Granted Patent US 9,031,313
Granted Patent B2
US 9,031,313 · App. 12/781,232 · Granted May 12, 2015

Inspection system

Inventors: Hideo Tsuchiya (Tokyo, JP); Fumio Ozaki (Kanagawa, JP)
Assignees: NuFlare Technology, Inc.; Kabusiki Kaisha Toshiba; NEC Corporation
G03F1/84G06T7/001G06T2207/30148G01N21/95607G01N2021/95676
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Quick Facts
Patent No.
US 9,031,313
App. No.
12/781,232
Granted
May 12, 2015
Kind
B2
Abstract

The entire surface of a photomask 101 is inspected after data and parameters of the lithography simulator are set in the operation setting screen of a control computer 110 and after the inspection system 100 is calibrated. The coordinates of a portion or portions determined in the inspection to be a defect are written into an XML file. When the inspection system 100 is in the die-to-database inspection mode, the control computer 110 reads pattern data from the database, which data is used by the inspection system 100 to generate reference data, and then converts the read pattern data into OASIS format, which is highly versatile. The optical image captured by the inspection system 100 is converted into a bitmap. These data are sent to the lithography simulator, together with simulation operating conditions and the image data that was used to calibrate the inspection system 100.

Claims (26)

1. An inspection apparatus comprising:

an optical image capture unit configured to capture optical images of an object to be inspected by irradiating the object with light;

a comparing unit configured to compare a first optical image with reference information to determine coordinates of a portion of the first optical image determined to be a defect, wherein the first optical image and the coordinates of the portion together form a first inspection result; and

an interface unit configured to output to a lithography simulator the first optical image and the coordinates,

wherein the interface unit is connected to the lithography simulator through a general communications network and is configured to instruct the lithography simulator to generate a first simulated image of the portion of the first optical image, generate a second simulated image using the reference information, compare the first and second simulated images, identify a defect if a difference between the first and second simulated images exceeds a predetermined threshold, and send a result of the comparison to the comparing unit; and

wherein the comparing unit is configured to inspect a second optical image different from the first optical image selected based upon the result of the comparison and produce a second inspection result, and configured to display the first and second inspection results.

2. The inspection apparatus according to claim 1 , wherein the object to be inspected is divided into stripes to continuously acquire the first optical image; and

the first inspection result is sent from the interface unit to the lithography simulator when inspection of a predetermined number of stripes is completed.

3. An inspection apparatus comprising:

an optical image capture unit configured to capture a first optical image of an object to be inspected by irradiating the object with light;

a reference image generating unit configured to generate a first reference image from design data of the object to be inspected;

a comparing unit configured to compare the first optical image with the first reference image to determine coordinates of a portion of the first optical image determined to be a defect, wherein a second reference image is newly generated from the design data and coordinates of a portion of the first optical image determined to be a defect by the comparison, and wherein the first optical image, the second reference image, and the coordinates of the portion together form a first inspection result; and

an interface unit configured to output to a lithography simulator the first optical image, the second reference image newly generated from the design data, and the coordinates of the portion determined to be a defect by the comparison, and instruct the lithography simulator to produce simulated images from the first optical image and the second reference image, compare the simulated images, and identify a defect based upon the comparison of the simulated images,

wherein the comparing unit is configured to inspect a second optical image different from the first optical image selected based upon the comparison of the simulated images and produce a second inspection result, and configured to display the first and second inspection results; and

wherein the interface unit is connected to the lithography simulator through a general communications network.

4. The inspection apparatus according to claim 3 , wherein the second reference image is prepared by extracting data from the design data, the extracted data being required to visually recognize a pattern around the portion determined to be the defect.

5. The inspection apparatus according to claim 3 , wherein the object to be inspected is divided into stripes to continuously acquire the optical image; and

the first inspection result is sent from the interface unit to the lithography simulator when inspection of a predetermined number of stripes is completed.

6. An inspection apparatus comprising:

an optical image capture unit configured to capture a first optical image of an object to be inspected by irradiating the object with light; and

an inspection unit configured to inspect the first optical image by comparing the first optical image with reference information to determine coordinates of a portion of the first optical image determined to be a defect, wherein the first optical image and the coordinates of the portion together form a first inspection result; and

an interface unit connected to a lithography simulator through a general communications network,

wherein:

the inspection unit is configured to output to the lithography simulator the first optical image, the reference information and the coordinates when a predetermined number of defects are found, using the interface unit, before inspection of the first optical image is completed;

the interface unit is configured to instruct the lithography simulator to generate a first simulated image of the portion of the first optical image, generate a second simulated image using the reference information, compare the first and second simulated images, identify a defect if a difference between the first and second simulated images exceeds a predetermined threshold, and send results of the comparison to the inspection unit; and

the inspection unit is configured to produce a second inspection result using the first inspection result and the results of the lithography simulator and to display the first and second inspection results.

Assignments (5)
CONFIRMATORY ASSIGNMENT Recorded Feb 7, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051841/0432 →
CHANGE OF NAME Recorded Feb 7, 2020
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 051842/0789 →
MERGER AND CHANGE OF NAME Recorded Feb 7, 2020
From: TOSHIBA MEMORY CORPORATION; K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051855/0531 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2010
From: ADVANCED MASK INSPECTION TECHNOLOGY INC.
To: KABUSHIKI KAISHA TOSHIBA; NEC CORPORATION
Reel/Frame 025367/0711 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2010
From: TSUCHIYA, HIDEO; OZAKI, FUMIO
To: NUFLARE TECHNOLOGY, INC.; ADVANCED MASK INSPECTION TECHNOLOGY INC.
Reel/Frame 024394/0898 →
Priority Claims (1)
JP 2009-189605 · Aug 18, 2009 · national
Continuity (1)
Related Publication 20110044528A1 · Feb 24, 2011