Integrated circuit structure with capacitor and resistor and method for forming
An integrated circuit structure with a metal-to-metal capacitor and a metallic device such as a resistor, effuse, or local interconnect where the bottom plate of the capacitor and the metallic device are formed with the same material layers. A process for forming a metallic device along with a metal-to-metal capacitor with no additional manufacturing steps.
1. An integrated circuit, comprising:
a dielectric layer;
a resistive metallic layer over and in direct contact with the dielectric layer;
a conductive etch stop layer over and in direct contact with the resistive metallic layer
a metal-to-metal capacitor with a bottom plate consisting essentially of an electrode material, a first portion of the conductive etch stop layer, and a first portion of the resistive metallic layer, wherein the electrode material is over and in direct contact with the first portion of the conductive etch stop layer which is over and in direct contact with the first portion of the resistive metallic layer and
a metallic device consisting essentially of a second portion of said conductive etch stop layer over and in direct contact with a second portion of said resistive metallic layer.
2. The integrated circuit of claim 1 wherein said metallic device is a resistor and said resistive metallic layer is selected from the group consisting of TiAl, Ti, TiN, Ta, TaN, Ir/TiAlN, Ir, TiAlN, SiCr, NiCr, and TiWN.
3. The integrated circuit of claim 1 wherein said conductive etch stop layer is selected from the group consisting of TiAlON, TiAlN, and TiAlO.
4. The integrated circuit of claim 1 wherein said resistive metallic layer is TiAl with a thickness of 50 to 500 nm and wherein said conductive etch stop layer is TiAlON with a thickness of 50 nm to 100 nm.
5. The integrated circuit of claim 1 wherein said metallic device is a local interconnect and said first metallic material is selected from the group consisting of TiAl, W, TiW, Ti, Ta, and TaN.
6. The integrated circuit of claim 1 wherein said metallic device is an electrically programmable fuse and said first metallic material is selected from the group consisting of TiN, TaN, TiW, TiAlN, and TiAlO.
7. An integrated circuit, comprising:
a dielectric layer;
a resistive metallic layer over and in direct contact with the dielectric layer;
a conductive etch stop layer over and in direct contact with the resistive metallic layer
a metal-to-metal capacitor having a bottom plate, capacitor dielectric, and a top plate, wherein the bottom plate consists essentially of an electrode material, a first portion of the conductive etch stop layer, and a first portion of the resistive metallic layer, wherein the electrode material is over and in direct contact with the first portion of the conductive etch stop layer which is over and in direct contact with the first portion of the resistive metallic layer, and wherein the capacitor dielectric is over and in direct contact with the electrode material; and
a metallic device consisting essentially of a second portion of said conductive etch stop layer over and in direct contact with a second portion of said resistive metallic layer.
8. The integrated circuit of claim 7 wherein said metallic device is a resistor and said resistive metallic layer is selected from the group consisting of TiAl, Ti, TiN, Ta, TaN, Ir/TiAlN, Ir, TiAlN, SiCr, NiCr, and TiWN.
9. The integrated circuit of claim 7 wherein said conductive etch stop layer is selected from the group consisting of TiAlON, TiAlN, and TiAlO.
10. The integrated circuit of claim 7 wherein said resistive metallic layer is TiAl with a thickness of 50 to 500 nm and wherein said conductive etch stop layer is TiAlON with a thickness of 50 nm to 100 nm.