Using unstable nitrides to form semiconductor structures
View Patent ↗Incompatible materials, such as copper and nitrided barrier layers, may be adhered more effectively to one another. In one embodiment, a precursor of copper is deposited on the nitrided barrier. The precursor is then converted, through the application of energy, to copper which could not have been as effectively adhered to the barrier in the first place.
1. A semiconductor structure comprising:
a substrate;
a substantially nitride free metal nanowire over said substrate; and
a metal nitride over said nanowire, said metal nitride including at least three metal atoms per nitrogen atom.
2. The structure of claim 1 wherein said nanowire is copper.
3. The structure of claim 1 wherein said substrate is a nitride.
4. The structure of claim 3 wherein said substrate includes tungsten or titanium nitride.
5. A semiconductor structure comprising:
a substrate;
a metal nanowire nitride layer over said substrate; and
a region of substantially nitride free metal formed in said layer.
6. The structure of claim 5 wherein said metal nitride includes the same metal as said substantially nitride free metal.