High density connector for interconnecting fine pitch circuit packaging structures
View Patent ↗A pinned interposer and mating sockets to facilitate removable mounting of high connection density micro devices between a pair of substrates in compact electronic circuit packages. The pinned interposer has an inner set of contacts, typically in a rectangular array, that, in cooperation with a mating socket, allows pluggable connection of a micro device such as a MEMS device connected to a first printed circuit substrate. An outer set of contacts on the interposer provides electrical interconnection between the first substrate and a second substrate located atop the high connection density micro device, thereby effectively sandwiching the micro device between the first and second substrates. The outer set of contacts may be disposed in a circular array.
1. A connector for attaching a high connection density micro device to a pair of spaced-apart substrates, comprising:
a) an interposer having a substantially planar body and an outer set of contacts disposed in a first pattern adjacent a perimeter thereof, said outer set of contacts each having a lower portion projecting below a lower surface of said body and an upper portion having a first length projecting above an upper surface of said body and an inner set of contacts disposed in a second pattern inwardly of said outer set of contacts, each of said inner set of contacts having said lower portion projecting below said lower surface of said body and said upper portion having a second length projecting above said upper surface of said body, said second length being shorter than said first length;
b) an upper socket having a first pattern of contacts disposed on a lower surface thereof and adapted to receive distal ends of said outer set of contacts therein; and
c) a lower socket having a second pattern of contacts adapted to receive distal ends of said inner set of contacts at a lower surface thereof and a set of contacts adapted to removably receive a micro electronic device therein.
2. The connector for attaching a high connection density micro device to a pair of spaced-apart substrates as recited in claim 1 , wherein said outer set of contacts is disposed in a substantially circular array.
3. The connector for attaching a high connection density micro device to a pair of spaced-apart substrates as recited in claim 2 , wherein said inner set of contacts is disposed in a substantially rectangular array.
4. The connector for attaching a high connection density micro device to a pair of spaced-apart substrates as recited in claim 3 , wherein said substantially rectangular array matches a pin array of a micro electronic device to be received therein.
5. The connector for attaching a high connection density micro device to a pair of spaced-apart substrates as recited in claim 1 , wherein said inner set of contacts is disposed in a substantially rectangular array.
6. The connector for attaching a high connection density micro device to a pair of spaced-apart substrates as recited in claim 5 , wherein said substantially rectangular array matches a pin array of a micro electronic device to be received therein.
7. The connector for attaching a high connection density micro device to a pair of spaced-apart substrates as recited in claim 5 , further comprising a lower socket assembly comprising means for permanent attachment to a micro electronic device.
8. The connector for attaching a high connection density micro device to a pair of spaced-apart substrates as recited in claim 1 , wherein said upper socket comprises means for permanent attachment thereof to an upper circuit substrate.
9. A method for removably connecting a micro electronic device between a pair of planar circuit substrates, the steps comprising:
a) providing a connector comprising:
i) an interposer having a substantially planar body and an outer set of contacts disposed in a first pattern adjacent a perimeter thereof, said outer set of contacts each having a lower portion projecting below a lower surface of said body and an upper portion having a first length projecting above an upper surface of said body, and an inner set of contacts disposed in a second pattern inwardly of said outer set of contacts, each of said inner set of contacts having said lower portion projecting below said lower surface of said body and said upper portion having a second length projecting above said upper surface of said body, said second length being shorter than said first length;
ii) an upper socket having a first pattern of contacts disposed on a lower surface thereof and adapted to receive distal ends of said outer set of contacts therein; and
iii) a lower socket having a second pattern of contacts adapted to receive distal ends of said inner set of contacts at a lower surface thereof and a set of contacts adapted to receive a micro electronic device removably therein;
b) connecting said lower portions of said outer set and said inner set of pins to a first substrate;
c) connecting said upper socket to a second substrate;
d) connecting a micro electronic device to said lower socket;
e) plugging said lower socket connected to said micro electronic device onto said inner set of pins; and
f) plugging said upper socket onto said outer set of pins.
10. The method for removably connecting a micro electronic device between a pair of planar circuit substrates as recited in claim 9 , wherein said connecting step (d) comprises permanently connecting said lower socket to said micro electronic device.