IP Library Granted Patent US 9,363,905
Granted Patent B2
US 9,363,905 · App. 12/794,496 · Granted Jun 7, 2016

Cosmetic co-removal of material for electronic device surfaces

Inventors: Scott Myers (San Francisco, CA); Richard Heley (Palo Alto, CA); Matthew Theobald (San Francisco, CA); Adam Stagnaro (Santa Cruz, CA); Tang Tan (Palo Alto, CA); Richard Dinh (San Jose, CA); David Pakula (San Francisco, CA)
Assignee: APPLE INC.
H05K5/02G06F1/1626G06F1/1656H05K5/03H04M1/0249Y10T29/49002Y10T29/49169
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Quick Facts
Patent No.
US 9,363,905
App. No.
12/794,496
Granted
Jun 7, 2016
Kind
B2
Abstract

This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

Claims (34)

1. An electronic device component, comprising:

a rigid structural member forming a continuous external surface of an electronic device, defining a sidewall of the electronic device, and defining an internal volume for receiving at least a portion of the electronic device, the rigid structural member comprising:

a first element comprising an electrically conductive material and forming a first portion of the continuous exterior surface, the first element forming at least a portion of an antenna of an electrical circuit disposed within the internal volume;

a second element comprising an electrically conductive material and forming a second portion of the continuous exterior surface; and

an intermediate element providing an interlocking interface between the first element and the second element, the intermediate element formed from an electrically insulating material and forming a third portion of the continuous exterior surface.

2. The electronic device component of claim 1 , wherein the first and second portions of the continuous external surface are smooth.

3. The electronic device component of claim 2 , wherein the first and second portions of the continuous external surface define a single plane.

4. The electronic device component of claim 1 , wherein the intermediate element is molded between the first and second elements.

5. The electronic device component of claim 1 , wherein, the rigid structural member further comprises a third element having a U-shape.

6. The electronic device component of claim 1 , wherein the intermediate element rigidly bonds the first element to the second element.

7. The electronic device component of claim 1 , further comprising an adhesive between the intermediate element and the first and second elements.

8. The electronic device component of claim 1 , wherein:

the intermediate element interlocks with the first element by at least partially filling an internal feature of the first element; and

the intermediate element interlocks with the second element by at least partially filling an internal feature of the second.

9. The electronic device component of claim 1 , wherein:

the first element comprises a protrusion extending from an interior surface of the first element; and

the second element comprises a protrusion extending from an interior surface of the second element; wherein

the protrusion of the first element and the protrusion of the second element each at least partially engage the intermediate element.

10. An outer periphery member of an electronic device, comprising:

a rigid structural member defining an internal volume for enclosing an electronic circuit of the electronic device and forming a sidewall of the electronic device, the rigid structural member comprising:

a first element defining a first exterior face of the electronic device and defining a first cavity formed within a first interior surface of the first element, the first element forming at least a portion of an antenna of the electronic circuit;

a second element defining a second exterior face of the electronic device and defining a second cavity formed within a second interior surface of the second element; and

an intermediate element comprising an insulating material positioned at least partially within a gap between the first element and second element and coupled to the first cavity and the second cavity thereby forming an interlocking interface between the first element and the second element.

11. The outer periphery member of claim 10 , wherein the first cavity is substantially cylindrical.

12. The electronic device of claim 11 , wherein the first rigid structural element comprises an antenna of an electrical circuit disposed within the interior volume.

13. The electronic device of claim 11 , wherein:

the first interior surface is defined, at least in part, by a protrusion extending from the first rigid structural element; and wherein

the first undercut is defined at least partially within the protrusion.

14. The outer periphery member of claim 10 , wherein the intermediate element is formed from plastic.

15. An electronic device component, comprising:

a structural member forming a sidewall of the electronic device and forming at least a portion of an interior volume of the electronic device, the structural member comprising:

a first rigid structural element defining a first undercut in a first interior surface of the first rigid structural element;

a second rigid structural element defining a second undercut in a second interior surface of the second rigid structural element;

an intermediate element positioned in a gap between the first rigid structural element and the second rigid structural element and forming at least a portion of a continuous exterior surface of the electronic device; wherein the intermediate element is engaged with the first and second undercuts.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2010
From: MYERS, SCOTT; HELEY, RICHARD; THEOBALD, MATTHEW; STAGNARO, ADAM; TAN, TANG; DINH, RICHARD; PAKULA, DAVID
To: APPLE INC.
Reel/Frame 024721/0495 →
Continuity (4)
Provisional Application 61300780 · Feb 2, 2010
Provisional Application 61325625 · Apr 19, 2010
Provisional Application 61325786 · Apr 19, 2010
Related Publication 20110186325A1 · Aug 4, 2011