IP Library › Granted Patent US 8,482,889
Granted Patent B2
US 8,482,889 · App. 12/795,429 · Granted Jul 9, 2013

Band-pass structure electrostatic discharge protection circuit

Inventors: Bo-Jr Huang (Taipei, TW); Huei Wang (Taipei, TW)
Assignee: National Taiwan University
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,482,889
App. No.
12/795,429
Granted
Jul 9, 2013
Kind
B2
Abstract

The present invention relates to an electrostatic discharge (ESD) protection circuit, and more particularly to a band-pass structure electrostatic discharge protection circuit. An ESD protection circuit is disposed at the input of a radio frequency (RF) core circuit. The ESD protection circuit comprises a plurality of diodes and inductors constructing a plurality of discharging paths, wherein the diodes and inductors forms a band-pass filter structure. Such that, the RF core circuit with the ESD protection circuit of the present invention feature much higher ESD robustness and better RF performance than the conventional design.

Claims (26)

1. A band-pass structure electrostatic discharge (ESD) protection circuit which is connected between an external pad and an input/output (I/O) port of a radio frequency (RF) core circuit, comprising:

a first diode and a second diode, wherein the first diode is connected between a power source and the external pad, the second diode is connected between the external pad and the ground, and the first diode and the second diode are connected in series;

a third diode and a fourth diode, wherein the third diode is connected between the power source and the I/O port, the fourth diode is connected between the I/O port and the ground, and the third diode and the fourth diode are connected in series;

a fifth diode and a sixth diode connected between the external pad and the I/O port reversely in parallel;

a first inductor connected between the external pad and the ground; and

a second inductor connected between the I/O port and the ground,

wherein the operation frequency of the RF core circuit is ω,

wherein the equivalent capacitance of each diode is C ESD and

wherein the inductance of each inductor is 1/(C ESD ω 2 ).

2. The band-pass structure ESD protection circuit of claim 1 , wherein the first inductor and the second inductor are spiral inductors.

3. The band-pass structure ESD protection circuit of claim 1 , wherein the RF core circuit and the band-pass structure ESD protection circuit are fabricated by gallium arsenic (GaAs) heterojunction bipolar transistor process.

4. The band-pass structure ESD protection circuit of claim 1 , wherein the RF core circuit and the band-pass structure ESD protection circuit are integrated in a chip.

5. The band-pass structure ESD protection circuit of claim 1 , wherein the band-pass structure ESD protection circuit provides protection of ESD stress in human body model.

6. The band-pass structure ESD protection circuit of claim 1 , wherein band-pass structure ESD protection circuit provides protection of ESD stress in machine model.

7. The band-pass structure ESD protection circuit of claim 1 , wherein the RF core circuit is selected from one of a RF transceiver, a low noise amplifier, a power amplifier, or a mixer.

8. The band-pass structure ESD protection circuit of claim 1 , wherein the external pad is connected to an antenna or another I/O element.

9. A band-pass structure ESD protection circuit which is connected between an external pad and an I/O port of an RF core circuit, comprising:

a plurality of first diodes and second diodes, wherein each pair of first diode and second diode is connected between a power source and the ground in series;

at least one pair of third diode and fourth diode, wherein each pair of third diode and fourth diode is connected between adjacent pairs of first diodes and second diodes reversely in parallel;

a first inductor connected between the external pad and the ground; and

a second inductor connected between the I/O port and the ground,

wherein the operation frequency of the RF core circuit is ω,

wherein the equivalent capacitance of each diode is C ESD and

wherein the inductance of each inductor is 1/(C ESD ω 2 ).

10. The band-pass structure ESD protection circuit of claim 9 , wherein the first inductor and the second inductor are spiral inductors.

11. The band-pass structure ESD protection circuit of claim 9 , wherein the RF core circuit and the band-pass structure ESD protection circuit are fabricated by GaAs heterojunction bipolar transistor process.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2010
From: HUANG, BO-JR; WANG, HUEI
To: NATIONAL TAIWAN UNIVERSITY
Reel/Frame 024506/0347 →
Priority Claims (1)
TW 99102242 A · Jan 27, 2010 · national
Continuity (1)
Related Publication 20110181990A1 · Jul 28, 2011