Method of assembling semiconductor device with heat spreader
View Patent ↗A method for packaging a semiconductor die or assembling a semiconductor device that includes a heat spreader begins with attaching the heat spreader to a film and dispensing a mold compound in granular form onto the film such that the mold compound at least partially covers the film and the heat spreader. The film with the attached heat spreader is placed in a first mold section. A substrate having a semiconductor die attached and electrically coupled to it are placed in a second mold section and then the first and second mold sections are mated such that the die is covered by the heat spreader. The granular mold compound is then melted so that the mold compound covers the die and sides of the heat spreader. The first and second mold sections then are separated. The film, which adheres to the substrate, is removed to expose a top surface of the heat spreader, and thus a semiconductor device is formed.
1. A method of assembling a semiconductor device including a heat spreader, the method comprising:
attaching the heat spreader to a film;
dispensing a mold compound onto the film such that the mold compound at least partially covers the film and the heat spreader;
placing the film with the attached heat spreader into a first mold section;
providing a substrate having a semiconductor die attached and electrically coupled thereto;
attaching the substrate with the attached die to a second mold section;
mating the first and second mold sections such that the die is covered by the heat spreader;
melting the mold compound at least until the mold compound covers the die and sides of the heat spreader;
separating the first and second mold sections, wherein the film adheres to the substrate; and
removing the film to expose a top surface of the heat spreader, whereby the semiconductor device is formed.
2. The method of assembling a semiconductor device of claim 1 , wherein the film is heat resistant and has an adhesive on its opposing major surfaces.
3. The method of assembling a semiconductor device of claim 1 , wherein the heat spreader has a generally U-shaped cross-section.
4. The method of assembling a semiconductor device of claim 3 , wherein the heat spreader is spaced from the substrate.
5. The method of assembling a semiconductor device of claim 1 , wherein the mold compound initially is in granular form.
6. The method of assembling a semiconductor device of claim 1 , wherein the heat spreader is attached to the film with a double-sided tape.
7. The method of assembling a semiconductor device of claim 1 , wherein the first mold section includes a mold cavity.
8. The method of assembling a semiconductor device of claim 7 , wherein the film is adhered within the mold cavity of the first mold section with vacuum pressure.
9. The method of assembling a semiconductor device of claim 1 , wherein the granular mold compound is melted by applying heat to the first and second mold sections.
10. The method of assembling a semiconductor device of claim 9 , wherein the mold compound is cured, after melting, while the film and substrate are still within the first and second mold sections.
11. The method of assembling a semiconductor device of claim 1 , further comprising the step of singulating the film to separate adjacent devices from each other.
12. A method of assembling a semiconductor device including a heat spreader, the method comprising:
attaching the heat spreader to a heat resistant film;
placing the film with the attached heat spreader into a first mold section;
dispensing a mold compound onto the film such that the mold compound at least partially covers the film and the heat spreader;
providing a substrate having a semiconductor die attached and electrically coupled thereto;
attaching the substrate with the attached die to a second mold section;
mating the first and second mold sections such that the die is covered by the heat spreader;
heating the mold compound, wherein after melting, at least the die and sides of the heat spreader are covered by the mold compound;
separating the first and second mold sections, wherein the film adheres to the substrate; and
removing the film to expose a top surface of the heat spreader, whereby the semiconductor device is formed.
13. The method of assembling a semiconductor device of claim 12 , wherein the heat spreader is spaced from the substrate.
14. The method of assembling a semiconductor device of claim 12 , wherein the dispensing step occurs after the mating step.
15. A method of assembling a semiconductor device including a heat spreader having a generally U-shaped cross-section, the method comprising:
attaching the heat spreader to a heat resistant film with a double-sided tape;
dispensing a mold compound onto the film such that the mold compound at least partially covers the film and the heat spreader;
placing the film with the attached heat spreader into a first mold section;
providing a substrate having a semiconductor die attached and electrically coupled thereto;
attaching the substrate with the attached die to a second mold section;
mating the first and second mold sections such that the die is covered by the heat spreader;
melting the mold compound at least until the mold compound covers the die and sides of the heat spreader;
curing the mold compound;
separating the first and second mold sections, wherein the film adheres to the substrate; and
removing the film to expose a top surface of the heat spreader, whereby the semiconductor device is formed.
16. The method of assembling a semiconductor device of claim 14 , wherein the mold compound is initially in a granular form.
17. The method of assembling a semiconductor device of claim 14 , wherein the heat spreader is spaced from the substrate.