Semiconductor devices having stressor regions and related fabrication methods

1. A method of fabricating a semiconductor device structure on an isolated region of semiconductor material, the method comprising:

forming a plurality of gate structures overlying the isolated region of semiconductor material, wherein each gate structure comprises a gate cap of capping material;

masking edge portions of the isolated region of semiconductor material with a mask comprising a masking material that is the same as the capping material;

while the edge portions are masked:

forming recesses between gate structures of the plurality of gate structures; and

forming stressor regions in the recesses;

simultaneously unmasking the edge portions and the gate structures; and

implanting ions of a conductivity-determining impurity type into the stressor regions and the edge portions.

2. The method of claim 1 , wherein:

the isolated region of semiconductor material is bordered by a region of insulating material; and

masking edge portions of the isolated region of semiconductor material comprises forming a mask overlying portions of the isolated region of semiconductor material disposed between outer gate structures of the plurality of gate structures and the region of insulating material.

3. The method of claim 1 , wherein masking edge portions of the isolated region comprises:

forming a masking material overlying the isolated region of semiconductor material; and

etching the masking material to obtain a mask overlying the edge portions of the isolated region, wherein the mask exposes portions of the isolated region of semiconductor material disposed between gate structures of the plurality of gate structures.

4. The method of claim 1 , the isolated region comprising an N-type region of semiconductor material, wherein:

forming the stressor regions comprises forming a stress-inducing semiconductor material comprising silicon and germanium in the recesses; and

implanting ions comprises implanting P-type ions into the stress-inducing semiconductor material and the edge portions.

5. The method of claim 1 , the isolated region comprising a P-type region of semiconductor material, wherein:

forming the stressor regions comprises forming a stress-inducing semiconductor material comprising silicon and carbon in the recesses; and

implanting ions comprises implanting N-type ions into the stress-inducing semiconductor material and the edge portions.

6. The method of claim 1 , wherein the capping material and the masking material are a nitride material, and wherein simultaneously unmasking the edge portions and the gate structures comprises simultaneously etching the capping material and the masking material with an etchant.

7. A method of fabricating a multi-finger semiconductor device structure on an isolated region of semiconductor material, the method comprising:

forming a plurality of gate structures overlying the isolated region of semiconductor material, wherein each gate structure corresponds to a finger of the multi-finger semiconductor device structure;

masking edge portions of the isolated region of semiconductor material, wherein inner gate structures between the masked edges remain exposed and wherein gate structures at longitudinal ends of the isolated region of semiconductor material are at least partially masked;

while the edge portions are masked:

forming recesses between gate structures of the plurality of gate structures; and

forming stressor regions in the recesses;

unmasking the edge portions; and

implanting ions of a conductivity-determining impurity type into the stressor regions and the edge portions, wherein ions are implanted in one stressor region on one side and ions are implanted in the semiconductor material on another side of the gate structures at longitudinal ends of the isolated region of semiconductor material, and wherein ions are implanted in stressor regions formed on both sides of inner gate structures.