Method and structure for coaxial via routing in printed circuit boards for improved signal integrity
View Patent ↗A method and a structure for a coaxial via that extend along the entire length of a signal via in a printed circuit board. Signal integrity is improved by providing ground shield for the entire length of the coaxial via. The ground shielding can be implemented by either providing ground cage vias around a signal via and routing a trace to the signal via on a built up layer or by providing a semi circle ground trench through a build up layer to permit a trace access to the signal via.
1. A structure for a coaxial signal via routing in printed circuit board for improving signal integrity, comprising: a structure formed of more than on structures including a first structure and a second structure wherein said second structure is located on top of said first structure and said first and second structures each includes a multi-layered printed circuit board including at least one coaxial via plated; and a ground trench formed around signal via that extends for an entire length of the coaxial signal via and down to a bottom of a ground reference of the layer below of said first structure and UP to the plane on said second structure where the trace enters the coaxial signal via and attaches to the signal via to permit the signal via to extend downward from a trace plane layer to attach to the signal via on a layer below.
2. The structure according to claim 1 wherein said ground trench is plated with metallic plating.
3. The structure according to claim 2 wherein said metallic plating is copper plating.
4. The structure according to claim 1 wherein said vias are filled with conductive paste.
5. A method for forming a structure for a coaxial signal via routing in printed circuit board for improving signal integrity, the steps comprising: forming a structure, a structure formed of more than one structure including a first structure and a second structure wherein said second structure is located on to of said first structure and said first and second structures each includes a multi-layered printed circuit board including at least one coaxial via plated; and forming a ground trench formed around a signal that extends for an entire length of the coaxial signal via and down to a bottom of the ground reference of the layer below of said first structure and UP to the plane on said second structure where the trace enters the coaxial signal via and attaches to the signal via to permit the signal via to extend downward from a trace plane layer to attach to the signal via on a layer below.