IP Library Granted Patent US 8,357,882
Granted Patent B2
US 8,357,882 · App. 12/800,333 · Granted Jan 22, 2013

Induction heated server

Inventors: Brian C. Jones (New Hartford, CT); Glenn H. Goyette (Harwinton, CT); Albert J. Beland (Stafford Springs, CT); Richard C. Runyan (Labadie, MO)
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Quick Facts
Patent No.
US 8,357,882
App. No.
12/800,333
Granted
Jan 22, 2013
Kind
B2
Abstract

An induction heatable server comprises a base element having top and bottom elements, said bottom element having a peripheral wall defining an upwardly opening cavity in which are disposed a heat retentive disc and a ring member which is bonded to the peripheral wall. A top element extends over the ring member and seals the cavity. The top element and ring member are bonded to the peripheral wall of the bottom element to preclude moisture penetration into the cavity.

Claims (14)

1. An induction heatable server comprising:

(a) a synthetic resin top element having a depending peripheral flange;

(b) a synthetic resin bottom element having a bottom wall and a peripheral wall with an upper portion extending over a peripheral portion of said top element and together defining a cavity;

(c) a heat retentive disc in said cavity, said bottom element being overmolded with synthetic resin about said heat retentive disc and having a generally horizontal flange extending over said peripheral portion of said top element to encapsulate said heat retentive disc and to firmly bond the top and bottom elements into a monolithic structure which precludes moisture penetration into said cavity; and

(d) a ring member extending about the periphery of said heat retentive disc, said ring member being overmolded and bonded to a peripheral portion of said bottom element.

2. The induction heatable server in accordance with claim 1 wherein there is included a layer of insulation in said cavity below said heat retentive disc.

3. The induction heatable server in accordance with claim 1 wherein said ring member has a body portion and a depending leg portion with an inwardly extending flange at its lower end.

4. The induction heatable server in accordance with claim 3 wherein said top element has a depending peripheral flange abutting the top and outer side surfaces of said ring member.

5. The induction heatable server in accordance with claim 1 wherein there is included an RFID tag sealed in a well in the lower surface of said bottom wall.

6. The induction heatable server in accordance with claim 3 wherein a high temperature polymer film is provided below the insulation to preclude flow of the overmolded resin into said insulation.

7. The induction heatable server in accordance with claim 4 where said ring has an inwardly extending flange on which said insulation and heat retentive disc are seated.

8. The induction heatable server in accordance with claim 1 wherein said top element has a generally vertical circumferential surface with closely spaced vertical ribs extending thereabout.

9. The induction heatable server in accordance with claim 3 wherein said inwardly extending flange extends diametrically across said ring member.

10. The induction heatable server in accordance with claim 9 wherein the said cavity is defined by said ring member, said top element, and said bottom element having a peripheral wall with an upper portion extending over the peripheral portion of said top element.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Jul 29, 2022
From: LOAN ADMIN CO LLC
To: SOUTHWEST MOLD, INC.
Reel/Frame 060677/0607 →
SECURITY INTEREST Recorded Jul 25, 2022
From: MOLDED DEVICES, INC.; MDI OF WISCONSIN, INC.; SOUTHWEST MOLD, INC.
To: CHURCHILL AGENCY SERVICES LLC, AS COLLATEARL AGENT
Reel/Frame 060602/0710 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: SIENA LENDING GROUP LLC
To: SEITZ LLC
Reel/Frame 057992/0380 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2021
From: SEITZ LLC
To: SOUTHWEST MOLD, INC.
Reel/Frame 057992/0644 →
SECURITY INTEREST Recorded Nov 2, 2021
From: SOUTHWEST MOLD, INC.
To: LOAN ADMIN CO LLC, AS COLLATERAL AGENT
Reel/Frame 057999/0791 →
RELEASE OF SECURITY INTEREST Recorded Apr 25, 2019
From: BERKSHIRE BANK
To: SEITZ LLC
Reel/Frame 048993/0693 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Apr 18, 2019
From: SEITZ LLC
To: SIENA LENDING GROUP LLC
Reel/Frame 048945/0850 →
SECURITY AGREEMENT Recorded Dec 14, 2011
From: SEITZ LLC
To: STONEHENGE CAPITAL FUND CONNECTICUT II, LLC
Reel/Frame 027379/0809 →
SECURITY AGREEMENT Recorded Nov 18, 2011
From: SEITZ, LLC
To: BERKSHIRE BANK
Reel/Frame 027249/0639 →
PATENT ASSIGNMENT AGREEMENT Recorded Nov 15, 2011
From: SEITZ CORPORATION
To: SEITZ LLC
Reel/Frame 027232/0755 →
Continuity (2)
Continuation In Part 12010768 · Jan 30, 2008
Related Publication 20100294753A1 · Nov 25, 2010