Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereof

1. A separation method of a nitride semiconductor layer, said separation method comprising the steps of:

growing a graphene layer in the form of a single layer or two or more layers on a surface of a first substrate;

forming a nitride semiconductor layer on said graphene layer so that said nitride semiconductor layer is bonded to said graphene layer with a bonding force due to regularity of potential at atomic level at an interface therebetween without utilizing covalent bonding; and

separating said nitride semiconductor layer from said first substrate with a force which is greater than said bonding force between said nitride semiconductor layer and said graphene layer, or greater than a bonding force between layers of said graphene layer.

2. A manufacturing method of a nitride semiconductor device, said manufacturing method comprising said separation method of said nitride semiconductor layer according to claim 1 ,

said manufacturing method further comprising the step of:

joining said nitride semiconductor layer to a surface of a second substrate.

3. The manufacturing method according to claim 2 , wherein said first substrate is a SiC substrate, and

wherein said nitride semiconductor layer includes a plurality of layers including a layer joined to said graphene layer, and said layer joined to said graphene layer is composed of a nitride layer.

4. The manufacturing method according to claim 2 , further comprising the step of:

dividing said nitride semiconductor layer into a plurality of regions.

5. The manufacturing method according to claim 2 , wherein said nitride semiconductor layer has a part or whole body of a light emitting element or electron element.

6. A manufacturing method of a semiconductor device, said manufacturing method comprising the steps of:

growing a graphene layer in the form of a single layer or two or more layers on a surface of a first substrate;

forming a nitride semiconductor layer on said graphene layer so that said nitride semiconductor layer is bonded to said graphene layer with a bonding force due to regularity of potential at atomic level at an interface therebetween without utilizing covalent bonding;

separating said nitride semiconductor layer from said first substrate with a force which is greater than said bonding force between said nitride semiconductor layer and said graphene layer; and

joining said separated nitride semiconductor layer to a surface of a second substrate.

7. The manufacturing method according to claim 6 , further comprising the step of:

dividing said nitride semiconductor layer into a plurality of regions.

8. The manufacturing method according to claim 6 , wherein said nitride semiconductor layer has a part or whole body of a light emitting element or electron element.

9. A manufacturing method of a semiconductor wafer, said manufacturing method comprising the steps of:

providing a graphene layer on a surface of a first substrate;

forming a lowermost layer of a single crystal semiconductor layer that includes a plurality of layers on said graphene layer in such a manner that one constituent element of a crystal of said single crystal semiconductor layer is adsorbed to a center portion of a honeycomb structure of carbon atoms of said graphene layer, and the other constituent element of said crystal is bonded to said one constituent element; and

growing other layers of said single crystal semiconductor layer on a surface of said lowermost layer.

10. The manufacturing method according to claim 9 , further comprising the steps of:

separating said graphene layer from a second substrate; and

joining said separated graphene layer to said surface of said first substrate by intermolecular force.

11. The manufacturing method according to claim 9 , wherein said single crystal semiconductor layer is composed of a nitride semiconductor layer containing at least one element selected among In, Ga and Al.

12. A semiconductor wafer comprising:

a first substrate;

a graphene layer separated from a second substrate different from said first substrate, said graphene layer being bonded to a surface of said first substrate; and

a single crystal semiconductor layer grown on a surface of said graphene layer;

wherein said single crystal semiconductor layer is formed in such a manner that one constituent element of a crystal of said single crystal semiconductor layer is adsorbed to a center portion of a honeycomb structure of carbon atoms of said graphene layer, and the other constituent element of said crystal is bonded to said one constituent element.

13. The semiconductor wafer according to claim 12 , wherein said graphene layer is bonded to a surface of said first substrate by intermolecular force.

14. The semiconductor wafer according to claim 12 , wherein said single crystal semiconductor layer is composed of a nitride semiconductor layer containing at least one element selected among In, Ga and Al.