Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.
1. A method for producing a photosemiconductor element mounting board having a recess composed of the bottom face and the wall faces, comprising:
a step of forming at least parts of the wall faces of the recess using the thermosetting resin composition comprising (A) an epoxy resin, (B) a curing agent and (D) a white pigment, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer, and the (B) curing agent contains a polyvalent carboxylic acid condensate with a component represented by the following formula (1):
where R x represents a divalent organic group derived from hydrogenated terephthalic acid and multiple R x groups in the same molecule are the same or different,
R y represents a monovalent organic group and the two R y groups in the same molecule are the same or different, and
n 1 represents an integer of 1 or greater.
2. The method according to claim 1 , wherein R y , is a monovalent hydrocarbon group optionally substituted with an acid anhydride or carboxylic acid ester group.