IP Library Granted Patent US 8,551,580
Granted Patent B2
US 8,551,580 · App. 12/805,926 · Granted Oct 8, 2013

Method for producing polycrystalline silicon

Inventors: Makoto Urushihara (Naka-gun, JP); Kazuki Mizushima (Saitama, JP)
Assignee: Mitsubishi Materials Corporation
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Quick Facts
Patent No.
US 8,551,580
App. No.
12/805,926
Granted
Oct 8, 2013
Kind
B2
Abstract

A polycrystalline silicon producing method with preventing meltdown and maintaining a high growing rate and a high yield by increasing temperature of raw material gas before supplying them to a reactor in a high pressure state so as to lower convection heat transfer from a silicon rod, including: supplying electric current to a silicon seed rod in a reactor to make the silicon seed rod to generate heat; and supplying a large amount of preheated raw material gas including chlorosilanes to the silicon seed rod in the reactor in the high pressure state.

Claims (22)

1. A polycrystalline silicon producing method comprising:

supplying electric current to at least one silicon seed rod in a reactor to make the silicon seed rod to generate heat;

supplying raw material gas including chlorosilanes in the reactor in which the silicon seed rod is provided; and

depositing polycrystalline silicon on a surface of the silicon seed rod to be grown as a silicon rod, wherein

a pressure in the reactor is maintained in a range equal to or greater than 0.4 MPa and equal to or less than 0.9 MPa,

a surface temperature of the silicon rod is maintained in a range equal to or higher than 1000° C. and equal to or lower than 1100° C.,

the raw material gas is preheated to a range equal to or higher than 150° C. and equal to or lower than 600° C. and then supplied to the reactor so as to maintain a chlorosilanes supply amount per unit time and per unit surface area in a range equal to or greater than 2.0×10 −7 mol/sec/mm 2 and equal to or less than 3.0×10 −7 mol/sec/mm 2 with growth of the diameter of the silicon rod.

2. The polycrystalline silicon producing method according to claim 1 , wherein the raw material gas is preheated by heat exchange between a discharge gas from the reactor and the raw material gas before being supplied to the reactor.

3. The polycrystalline silicon producing method according to claim 2 ,

wherein temperature of an inner surface of the reactor is adjusted to be equal to or higher than 250° C. and equal to or lower than 400° C.

4. The polycrystalline silicon producing method according to claim 2 ,

wherein in the reactor, a raw material gas-supply nozzle is disposed further from an inner surface of the reactor than the silicon seed rod positioned at the outermost circumference.

5. The polycrystalline silicon producing method according to claim 2 ,

wherein the pre-heat temperature of the raw material gas is in a range equal to or higher than 150° C. and equal to or lower than 400° C.

6. The polycrystalline silicon producing method according to claim 1 ,

wherein temperature of an inner surface of the reactor is adjusted to be equal to or higher than 250° C. and equal to or lower than 400° C.

7. The polycrystalline silicon producing method according to claim 6 ,

wherein in the reactor, a raw material gas-supply nozzle is disposed further from an inner surface of the reactor than the silicon seed rod positioned at the outermost circumference.

8. The polycrystalline silicon producing method according to claim 6 , wherein the pre-heat temperature of the raw material gas is in a range equal to or higher than 150° C. and equal to or lower than 400° C.

9. The polycrystalline silicon producing method according to claim 1 , wherein in the reactor, a raw material gas-supply nozzle is disposed further from an inner surface of the reactor than the silicon seed rod positioned at the outermost circumference.

10. The polycrystalline silicon producing method according to claim 9 , wherein the pre-heat temperature of the raw material gas is in a range equal to or higher than 150° C. and equal to or lower than 400° C.

11. The polycrystalline silicon producing method according to claim 1 , wherein the pre-heat temperature of the raw material gas is in a range equal to or higher than 150° C. and equal to or lower than 400° C.

Assignments (2)
SPLIT AND CHANGE OF NAME Recorded Jul 6, 2023
From: MITSUBISHI MATERIALS CORPORATION
To: HIGH-PURITY SILICON CORPORATION
Reel/Frame 064222/0720 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2010
From: URUSHIHARA, MAKOTO; MIZUSHIMA, KAZUKI
To: MITSUBISHI MATERIALS CORPORATION
Reel/Frame 024945/0186 →
Priority Claims (1)
JP 2009-199008 · Aug 28, 2009 · national
Continuity (1)
Related Publication 20110052914A1 · Mar 3, 2011