Replaceable cover for membrane carrier

1 . An object carrier used in a polishing device comprising:

a housing;

a retaining ring characterized by an inner diameter coupled to the housing, said retaining ring sized and dimensioned to receive the object;

a membrane having a first surface and extending across a bottom surface of a support member within the object housing, said membrane disposed within the inner diameter of said retaining ring; and

a first cover secured to said first surface of said membrane to protect the membrane from damage.

2 . The carrier of claim 1 wherein said first cover is removed from said membrane and replaced with a second cover.

3 . The carrier of claim 1 wherein said object comprises a wafer.

4 . The carrier of claim 1 wherein said protective cover comprises first and second surfaces, said first surface having an adhesive layer formed thereon.

5 . The carrier of claim 4 wherein said protective cover is made from an elastomer.

6 . The carrier of claim 1 wherein said protective cover is circular in shape.

7 . The carrier of claim 6 wherein the diameter of said protective cover is in the range between 100 mm and 450 mm.

8 . The carrier of claim 6 wherein the thickness of said protective cover is in the range between 1/64 inches and ⅛ inches.

9 . A method for polishing the surface of an object comprising:

providing an object carrier, the carrier comprising a housing, a retaining ring characterized by an inner diameter and coupled to the housing;

inserting a membrane having first and second surfaces, said first surface of said membrane extending across a bottom surface of a support member in the object carrier, within the inner diameter of the retaining ring; and

providing a first member having first and second surfaces, said first surface covering said second surface of said membrane thereby protecting said membrane from damage.

10 . The method of claim 9 wherein said first surface of said protective cover has an adhesive layer formed thereon.

11 . The method of claim 9 further including the step of inflating said membrane in the object carrier to apply downward force to said object.

12 . The method of claim 9 further including the step of removing said first protective cover from said membrane and replacing it with a second protective cover.

13 . The method of claim 9 wherein said object comprises a wafer to be polished.