Patent Assignment
Reel/Frame 041904/0158
Security Interest
Recorded: 2017-03-07
Pages: 11
Assignor
STRASBAUGH AND R.H. STRASBAUGH
Executed: 2015-11-13
Assignee
BFI BUSINESS FINANCE DBA CAPITALSOURCE BUSINESS FINANCE GROUP
851 E. HAMILTON AVENUE, #200, CAMPBELL, CALIFORNIA, 95008
Covered Properties
(80)
Chemical Mechanical Polishing Apparatus and Method
Patent:
6,045,716 →
Application:
08/892,795 →
Water-Repellent Glass Pane and Method for Producing Same
Patent:
6,337,133 →
Application:
08/914,171 →
Grinding Process and Apparatus for Planarizing Sawed Wafers
Patent:
5,964,646 →
Application:
08/971,642 →
Apparatus and Method for Reliably Releasing Wet, Thin Wafers
Patent:
6,254,155 →
Application:
09/228,113 →
Slurry Pump Control System
Patent:
6,183,341 →
Application:
09/248,167 →
Method for Chemical Mechanical Polishing
Method and Apparatus for Chemical Mechanical Polishing
Patent:
6,361,647 →
Application:
09/432,144 →
Pad Quick Release Device for Chemical Mechanical Polishing
Patent:
6,227,956 →
Application:
09/432,882 →
Polishing pad with built-in optical sensor
Patent:
6,485,354 →
Application:
09/590,470 →
Pad Quick Release Device for Chemical Mechanical Planarization
Patent:
6,464,574 →
Application:
09/693,040 →
Multi-pad apparatus for chemical mechanical planarization
Patent:
6,346,036 →
Application:
09/693,064 →
Pad Support Apparatus for Chemical Mechanical Planarization
Patent:
6,602,121 →
Application:
09/693,148 →
Pad Retrieval Apparatus for Chemical Mechanical Planarization
Patent:
6,527,621 →
Application:
09/693,152 →
Pad Transfer Apparatus for Chemical Mechanical Planarization
Patent:
6,450,860 →
Application:
09/693,153 →
Polishing Chemical Delivery for Small Head Chemical Mechanical Planarization
Patent:
6,514,121 →
Application:
09/699,202 →
High Planarity Chemical Mechanical Planarization
Patent:
6,520,843 →
Application:
09/699,283 →
Multi-Action Chemical Mechanical Planarization Device and Method
Patent:
6,514,129 →
Application:
09/699,285 →
Spherical Drive Assembly for Chemical Mechanical Planarization
Patent:
6,511,368 →
Application:
09/699,287 →
Wafer Support for Chemical Mechanical Planarization
Patent:
6,379,235 →
Application:
09/699,289 →
In Situ Feature Height Measurement During Cmp
Patent:
6,629,874 →
Application:
09/699,290 →
Hard Polishing Pad for Chemical Mechanical Planarization
Patent:
6,551,179 →
Application:
09/706,336 →
Combined Chemical Mechanical Planarization and Cleaning
Patent:
6,692,339 →
Application:
09/706,349 →
Subaperature Chemical Mechanical Planarization with Polishing Pad Conditioning
Patent:
6,547,651 →
Application:
09/709,972 →
Slurry Pump Control System
Patent:
6,595,829 →
Application:
09/777,501 →
Polishing Pad with Built-in Optical Sensor
Method of Spin Etching Wafers with an Alkali Solution
Method of Preparing Whole Semiconductor Wafer for Analysis
Method for Making a Polishing Pad with Built-in Optical Sensor
Polishing Pad with Optical Sensor
Polishing Pad Sensor Assembly with a Damping Pad
Protection of Work Piece During Surface Processing
Method for Applying an Insert or Tape to Chucks or Wafer Carriers Used for Grinding, Polishing, or Planarizing Wafers
Endpoint Detection System for Wafer Polishing
Method of Backgrinding Wafers While Leaving Backgrinding Tape on a Chuck
Modular Method for Chemical Mechanical Planarization
Pivotal Guard Cover for Hand-Held Kitchen Peeler
Device for Supporting Thin Semiconductor Wafers
Subaperture Chemical Mechanical Planarization with Polishing Pad Conditioning
Grinding Apparatus and Method
Wafer Carrier Pivot Mechanism
Back Pressure Control System for Cmp and Wafer Polishing
Slurry Pump Control System
Retaining Ring for Wafer Carriers
In Situ Feature Height Measurement
Patent:
6,976,901 →
Application:
10/681,047 →
Method of Backgrinding Wafers While Leaving Backgrinding Tape on a Chuck
Devices and Methods for Optical Endpoint Detection During Semiconductor Wafer Polishing
Endpoint Detection System for Wafer Polishing
Polishing Pad with Built-in Optical Sensor
Chuck for Supporting Wafers with a Fluid
Chemical-Mechanical Planarization Tool Force Calibration Method and System
Patent:
7,040,955 →
Application:
11/046,502 →
Wafer Carrier with Pressurized Membrane and Retaining Ring Actuator
Independent Edge Control for Cmp Carriers
Retaining Ring for Wafer Carriers
Method, Apparatus and System for Use in Processing Wafers
Polishing Pad with Built-in Optical Sensor
Back Pressure Control System for Cmp and Wafer Polishing
Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
Application:
11/393,041 →
Publication:
US 2007/0235133
Wafer Carrier with Pressurized Membrane and Retaining Ring Actuator
Endpoint Detection System for Wafer Polishing
Grinding Apparatus and Method
Wafer Carrier with Pressurized Membrane and Retaining Ring Actuator
Robot Calibration System and Method
Methods for Optical Endpoint Detection During Semiconductor Wafer Polishing
Method, Apparatus and System for Use in Processing Wafers
Flexible Membrane Assembly for a Cmp System and Method of Using
Cmp System with Wireless Endpoint Detection System
Grinding Apparatus Having an Extendable Wheel Mount
Endpoint Detection System for Wafer Polishing
Replaceable cover for membrane carrier
Application:
12/806,518 →
Publication:
US 2012/0040591
Wafer Carrier with Flexible Pressure Plate
Application:
13/243,808 →
Publication:
US 2013/0078812
Cmp Retaining Ring with Soft Retaining Ring Insert
System and Method for in Situ Monitoring of Top Wafer Thickness in a Stack of Wafers
Method for grinding wafers by shaping resilient chuck covering
Application:
13/573,148 →
Publication:
US 2014/0057531
Systems and Methods of Wafer Grinding
Method and apparatus for cleaning grinding work chuck using a vacuum
Systems and Methods of Processing Substrates
Methods and Systems for Use in Grind Shape Control Adaptation
Methods and Systems for Use in Grind Spindle Alignment
Cmp Retaining Ring with Soft Retaining Ring Insert
Method of Grinding Wafer Stacks to Provide Uniform Residual Silicon Thickness
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 19, 1997
From: AKAMATSU, YOSHINORI; HAMAGUCHI, SHIGEO; NISHIDA, YOSHIHIRO; YAMAMOTO, HIDEKI
To: CENTRAL GLASS COMPANY, LIMITED
Reel/Frame 008672/0426 →
Assignment of Assignor's Interest
Nov 17, 1997
From: KASSIR, SALMAN M.; WALSH, THOMAS A.
To: STRASBAUGH
Reel/Frame 008893/0678 →
Assignment of Assignor's Interest
Jun 1, 1998
From: TROJAN, DAN
To: STRASBAUGH
Reel/Frame 009240/0276 →
Assignment of Assignor's Interest
Jun 1, 1998
From: WALSH, THOMAS
To: STRASBAUGH
Reel/Frame 009239/0178 →
Assignment of Assignor's Interest
Jan 11, 1999
From: KASSIR, SALMAN M.
To: STRASBAUGH
Reel/Frame 009714/0794 →
Assignment of Assignor's Interest
Feb 9, 1999
From: MELCER, CHRIS
To: STRASBAUGH
Reel/Frame 009763/0518 →
Security Agreement
Sep 1, 1999
From: STRASBAUGH
To: FOOTHILL CAPITAL CORPORATION
Reel/Frame 010238/0512 →
Assignment of Assignor's Interest
Sep 28, 1999
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 010290/0095 →
Assignment of Assignor's Interest
Nov 2, 1999
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 010356/0842 →
Assignment of Assignor's Interest
Mar 6, 2000
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 010656/0440 →
Assignment of Assignor's Interest
Jun 9, 2000
From: WOLF, STEPHAN H.
To: STRASBAUGH, A CORP. OF CALIFORNIA
Reel/Frame 010857/0238 →
Assignment of Assignor's Interest
Oct 20, 2000
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011289/0740 →
Assignment of Assignor's Interest
Oct 20, 2000
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011271/0062 →
Assignment of Assignor's Interest
Oct 20, 2000
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011280/0427 →
Assignment of Assignor's Interest
Oct 20, 2000
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011286/0980 →
Assignment of Assignor's Interest
Oct 20, 2000
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011289/0731 →
Assignment of Assignor's Interest
Oct 23, 2000
From: HALLEY, DAVID G.; BOYD, JOHN M.; CURRY, JOHN; LACY, MIKE
To: STRASBAUGH
Reel/Frame 011203/0028 →
Assignment of Assignor's Interest
Nov 10, 2000
From: BOYD, JOHN MALCOLM; LACY, MICHAEL SCOTT; HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011305/0860 →
Assignment of Assignor's Interest
Mar 8, 2001
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011605/0113 →
Assignment of Assignor's Interest
Mar 16, 2001
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011683/0375 →
Assignment of Assignor's Interest
Mar 19, 2001
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011634/0416 →
Assignment of Assignor's Interest
Mar 19, 2001
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011637/0125 →
Assignment of Assignor's Interest
Mar 19, 2001
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011639/0499 →
Assignment of Assignor's Interest
Mar 19, 2001
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011633/0723 →
Assignment of Assignor's Interest
Mar 19, 2001
From: HALLEY, DAVID G.
To: STRASBAUGH
Reel/Frame 011633/0730 →