Devices and methods for optical endpoint detection during semiconductor wafer polishing
View Patent ↗A method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an optical sensor disposed within the polishing pad. The intensity of the reflected light is measured by a light detector also disposed in the polishing pad. The intensity of the reflected light varies sinusoidally with the change in layer thickness as the layer is removed. By measuring the absolute thickness of the layer at two or more points along the sinusoidal curve, the sinusoidal curve is calibrated so that a portion of the wavelength of the curve corresponds to a change in thickness of the layer.
1. A system for measuring a change in thickness of a layer of material disposed on a wafer while said layer is polished, said system comprising:
a polishing pad suitable for polishing the layer;
a sensor assembly disposed in the polishing pad, said sensor assembly comprising:
a light source capable of emitting a known wavelength of light;
a light detector capable of detecting the intensity of light incident on the light detector; and
an optical puck, wherein the light source and the light detector are contained within the optical puck and wherein the optical puck is transparent to a predetermined wavelength of light;
a means for conveying power to the light source and to the light detector, said means for conveying power operably connected to the sensor assembly; and
a processor operably connected to the light detector, wherein during polishing the intensity of light incident on the light detector varies sinusoidally with over the time of polishing, wherein the processor is programmed to measure a sinusoidal curve indicative of the intensity of detected light over time and wherein the processor is further programmed to measure the wavelength of the sinusoidal curve.
2. The system of claim 1 further comprising a control system operably connected to the processor and to a means for polishing the wafer, said control system capable of controlling the rate of polishing when the processor measures a predetermined wavelength of the sinusoidal curve.
3. The system of claim 1 wherein the optical puck is characterized by an outer surface facing outwardly from the pad and the polishing pad is characterized by an outer surface adapted to face the wafer, and wherein the outer surface of the optical puck is substantially flush with the outer surface of the polishing pad.
4. A system for measuring a change in thickness of a layer of material disposed on a wafer while said layer is polished, said system comprising:
a polishing pad suitable for polishing the layer;
a sensor assembly disposed in the polishing pad, said sensor assembly comprising:
a light source capable of emitting a known wavelength of light;
a light detector capable of measuring the intensity of light incident on the detector and a means for converting the intensity of light into an electrical signal corresponding to the intensity of the light incident on the detector; and
an optical puck, wherein the light source and the light detector are contained within the optical puck and wherein the optical puck is transparent to a predetermined wavelength of light;
a means for conveying power to the light source and to the light detector, said means for conveying power operably connected to the sensor assembly;
a means for conveying the electrical signal to a processor, said means for conveying the electrical signal operably connected to the sensor assembly;
wherein the processor is programmed to correlate a change in the electrical signal to a change in the thickness of the layer.
5. The system of claim 4 further comprising a control system operably connected to the processor and to a means for polishing the wafer, said control system capable of modifying the rate of polishing in response to the change in the thickness of the layer.
6. The system of claim 4 wherein the optical puck is characterized by an outer surface facing outwardly from the pad and the polishing pad is characterized by an outer surface adapted to face the wafer, and wherein the outer surface of the optical puck is substantially flush with the outer surface of the polishing pad.