Patent Assignment
Reel/Frame 066545/0924
Security Interest
Recorded: 2024-02-23
Pages: 12
Assignor
REVASUM, INC.
Executed: 2023-11-27
Assignee
SQN VENTURE INCOME FUND II, LP
320 BROAD STREET, SUITE #250, CHARLESTON, SOUTH CAROLINA, 29401
Covered Properties
(32)
Method of Backgrinding Wafers While Leaving Backgrinding Tape on a Chuck
Devices and Methods for Optical Endpoint Detection During Semiconductor Wafer Polishing
Endpoint Detection System for Wafer Polishing
Polishing Pad with Built-in Optical Sensor
Chuck for Supporting Wafers with a Fluid
Chemical-Mechanical Planarization Tool Force Calibration Method and System
Patent:
7,040,955 →
Application:
11/046,502 →
Wafer Carrier with Pressurized Membrane and Retaining Ring Actuator
Independent Edge Control for Cmp Carriers
Retaining Ring for Wafer Carriers
Method, Apparatus and System for Use in Processing Wafers
Polishing Pad with Built-in Optical Sensor
Back Pressure Control System for Cmp and Wafer Polishing
Wafer Carrier with Pressurized Membrane and Retaining Ring Actuator
Endpoint Detection System for Wafer Polishing
Grinding Apparatus and Method
Wafer Carrier with Pressurized Membrane and Retaining Ring Actuator
Robot Calibration System and Method
Methods for Optical Endpoint Detection During Semiconductor Wafer Polishing
Method, Apparatus and System for Use in Processing Wafers
Flexible Membrane Assembly for a Cmp System and Method of Using
Cmp System with Wireless Endpoint Detection System
Grinding Apparatus Having an Extendable Wheel Mount
Endpoint Detection System for Wafer Polishing
Cmp Retaining Ring with Soft Retaining Ring Insert
Method, Apparatus and System for Use in Processing Wafers
System and Method for in Situ Monitoring of Top Wafer Thickness in a Stack of Wafers
Systems and Methods of Wafer Grinding
Method and apparatus for cleaning grinding work chuck using a vacuum
Systems and Methods of Processing Substrates
Methods and Systems for Use in Grind Shape Control Adaptation
Methods and Systems for Use in Grind Spindle Alignment
Method of Grinding Wafer Stacks to Provide Uniform Residual Silicon Thickness
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Mar 7, 2017
From: STRASBAUGH AND R.H. STRASBAUGH
To: BFI BUSINESS FINANCE DBA CAPITALSOURCE BUSINESS FINANCE GROUP
Reel/Frame 041904/0158 →
Assignment of Assignor's Interest
Mar 8, 2017
From: BFI BUSINESS FINANCE DBA CAPITALSOURCE BUSINESS FINANCE GROUP
To: REVASUM, INC.
Reel/Frame 041909/0687 →
Release of Security Interest
May 10, 2022
From: AGILITY CAPITAL, LLC
To: STRASBAUGH
Reel/Frame 059913/0938 →
Security Interest
Dec 12, 2023
From: REVASUM, INC.
To: SQN VENTURE INCOME FUND II, LP
Reel/Frame 065849/0798 →