Patent Assignment
Reel/Frame 059913/0938
Release of Security Interest
Recorded: 2022-05-10
Pages: 8
Assignor
AGILITY CAPITAL, LLC
Executed: 2007-05-22
Assignee
STRASBAUGH
825 BUCKLEY ROAD, SAN LUIS OBISPO, CALIFORNIA, 93401
Covered Properties
(54)
Lap Shaping Machine with Oscillatable Point Cutter and Selectively Rotatable or Oscillatable Lap
Patent:
4,380,412 →
Application:
06/063,036 →
Wafer-Handling Apparatus Having a Resillent Membrane Which Holds Water When a Vacum Is Applied
Patent:
5,423,716 →
Application:
08/178,530 →
Wafer Carrier for Film Planarization
Patent:
5,449,316 →
Application:
08/178,531 →
Chemical Mechanical Polishing Apparatus and Method
Patent:
6,045,716 →
Application:
08/892,795 →
Grinding Process and Apparatus for Planarizing Sawed Wafers
Patent:
5,964,646 →
Application:
08/971,642 →
Parallel Alignment Method and Apparatus for Chemical Mechanical Polishing
Patent:
6,354,926 →
Application:
09/038,875 →
Apparatus for Sensing the Presence of a Wafer
Patent:
5,961,169 →
Application:
09/124,160 →
Apparatus and Method for Reliably Releasing Wet, Thin Wafers
Patent:
6,254,155 →
Application:
09/228,113 →
Accurate Positioning of a Wafer
Patent:
6,131,589 →
Application:
09/247,106 →
Non-Contacting Support for a Wafer
Patent:
6,283,827 →
Application:
09/247,107 →
Sensing the Presence of a Wafer
Patent:
6,267,642 →
Application:
09/247,108 →
Lifting and Rinsing a Wafer
Patent:
6,102,057 →
Application:
09/247,109 →
Slurry Pump Control System
Patent:
6,183,341 →
Application:
09/248,167 →
Optical View Port for Chemical Mechanical Planarization Endpoint Detection
Patent:
6,146,242 →
Application:
09/330,472 →
Method for Chemical Mechanical Polishing
Method and Apparatus for Chemical Mechanical Polishing
Patent:
6,361,647 →
Application:
09/432,144 →
Pad Quick Release Device for Chemical Mechanical Polishing
Patent:
6,227,956 →
Application:
09/432,882 →
Polishing pad with built-in optical sensor
Patent:
6,485,354 →
Application:
09/590,470 →
Lifting and Rinsing a Wafer
Patent:
6,505,635 →
Application:
09/608,618 →
Accurate Positioning of a Wafer
Patent:
6,405,740 →
Application:
09/630,507 →
Pad Quick Release Device for Chemical Mechanical Planarization
Patent:
6,464,574 →
Application:
09/693,040 →
Multi-pad apparatus for chemical mechanical planarization
Patent:
6,346,036 →
Application:
09/693,064 →
Pad Support Apparatus for Chemical Mechanical Planarization
Patent:
6,602,121 →
Application:
09/693,148 →
Pad Retrieval Apparatus for Chemical Mechanical Planarization
Patent:
6,527,621 →
Application:
09/693,152 →
Pad Transfer Apparatus for Chemical Mechanical Planarization
Patent:
6,450,860 →
Application:
09/693,153 →
Polishing Chemical Delivery for Small Head Chemical Mechanical Planarization
Patent:
6,514,121 →
Application:
09/699,202 →
Shaping Polishing Pad for Small Head Chemical Mechanical Planarization
Patent:
6,517,419 →
Application:
09/699,280 →
High Planarity Chemical Mechanical Planarization
Patent:
6,520,843 →
Application:
09/699,283 →
Multi-Action Chemical Mechanical Planarization Device and Method
Patent:
6,514,129 →
Application:
09/699,285 →
Spherical Drive Assembly for Chemical Mechanical Planarization
Patent:
6,511,368 →
Application:
09/699,287 →
Wafer Support for Chemical Mechanical Planarization
Patent:
6,379,235 →
Application:
09/699,289 →
In Situ Feature Height Measurement During Cmp
Patent:
6,629,874 →
Application:
09/699,290 →
Hard Polishing Pad for Chemical Mechanical Planarization
Patent:
6,551,179 →
Application:
09/706,336 →
Combined Chemical Mechanical Planarization and Cleaning
Patent:
6,692,339 →
Application:
09/706,349 →
Subaperature Chemical Mechanical Planarization with Polishing Pad Conditioning
Patent:
6,547,651 →
Application:
09/709,972 →
Optical View Port for Chemical Mechanical Planarization Endpoint Detection
Patent:
6,488,568 →
Application:
09/712,825 →
Polishing Pad with Built-in Optical Sensor
Method of Spin Etching Wafers with an Alkali Solution
Method of Preparing Whole Semiconductor Wafer for Analysis
Method for Making a Polishing Pad with Built-in Optical Sensor
Polishing Pad with Optical Sensor
Polishing Pad Sensor Assembly with a Damping Pad
Protection of Work Piece During Surface Processing
Method for Applying an Insert or Tape to Chucks or Wafer Carriers Used for Grinding, Polishing, or Planarizing Wafers
Endpoint Detection System for Wafer Polishing
Coupler for Coupling an Accessory to a Dipper Arm and a Control System for Such a Coupler
Modular Method for Chemical Mechanical Planarization
Device for Supporting Thin Semiconductor Wafers
Subaperture Chemical Mechanical Planarization with Polishing Pad Conditioning
Wafer Carrier Pivot Mechanism
Slurry Pump Control System
Retaining Ring for Wafer Carriers
Method of Backgrinding Wafers While Leaving Backgrinding Tape on a Chuck
Devices and Methods for Optical Endpoint Detection During Semiconductor Wafer Polishing
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 23, 2011
From: LAM RESEARCH CORPORATION
To: APPLIED MATERIALS, INC.
Reel/Frame 026006/0750 →
Security Interest
Mar 7, 2017
From: STRASBAUGH AND R.H. STRASBAUGH
To: BFI BUSINESS FINANCE DBA CAPITALSOURCE BUSINESS FINANCE GROUP
Reel/Frame 041904/0158 →
Assignment of Assignor's Interest
Mar 8, 2017
From: BFI BUSINESS FINANCE DBA CAPITALSOURCE BUSINESS FINANCE GROUP
To: REVASUM, INC.
Reel/Frame 041909/0687 →