Method of backgrinding wafers while leaving backgrinding tape on a chuck
View Patent ↗A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed from the tape and then cleaned on the front side and backside. A tool for applying tape to a chuck, as described herein, facilitates this method.
1. A method of backgrinding a wafer, said wafer characterized by a front side and a backside, said method comprising the steps of:
providing tape and a chuck, said tape suitable for protecting a wafer during backgrinding and said chuck suitable for use during backgrinding of the wafer;
placing the tape onto the chuck;
placing the wafer onto the tape with the front side of the wafer facing the tape;
thereafter backgrinding the backside of the wafer;
before removing the wafer from the tape, spraying the backside of the wafer with water under a pressure of about 40 PSI to about 60 PSI while scrubbing the backside of the wafer;
removing the wafer from the tape while leaving the tape on the chuck;
thereafter cleaning the front side of the wafer, wherein the step of cleaning the front side of the wafer comprises spraying the front side of the wafer with water under a pressure of about 500 PSI to about 1500 PSI while scrubbing the front side of the wafer; and
drying the wafer.
2. A method of preparing a wafer, said method comprising the steps of:
a) providing a wafer having a front side and a backside;
b) processing the wafer such that the wafer has a flatness and a thickness suitable for buildingup a device on the front side of the wafer;
c) building-up a device onto the front side of the wafer;
d) providing a chuck and a tape, wherein the chuck is suitable for supporting the tape during a backgrinding process, and wherein the tape is suitable for supporting the wafer;
e) after building up the device, placing the tape onto the chuck;
f) placing the front side of the wafer onto the tape;
g) securing the front side of the wafer to the tape;
h) grinding the backside of the wafer;
i) before removing the wafer from the tape, spraying the backside of the wafer with water under a pressure of about 500 PSI to about 1500 PSI while scrubbing the backside of the wafer;
j) removing the wafer from the tape;
k) thereafter cleaning the front side of the wafer, wherein the step of cleaning the front side of the wafer comprises spraying the front side of the wafer with water under a pressure of about 500 PSI to about 1500 PSI while scrubbing the front side of the wafer; and
l) drying the wafer.
3. A method of backgrinding a wafer, said wafer characterized by a front side and a backside, said method comprising the steps of:
providing a mesh and a chuck, said mesh suitable for protecting a wafer during backgrinding and said chuck suitable for use during backgrinding of the wafer;
placing the mesh onto the chuck;
placing the wafer onto the mesh with the front side of the wafer facing the mesh;
thereafter backgrinding the backside of the wafer;
before removing the wafer from the tape, spraying the backside of the wafer with water under a pressure of about 500 PSI to about 1500 PSI while scrubbing the backside of the wafer;
removing the wafer from the mesh while leaving the mesh on the chuck;
thereafter cleaning the front side of the wafer, wherein the step of cleaning the front side of the wafer comprises spraying the front side of the wafer with water under a pressure of about 500 PSI to about 1500 PSI while scrubbing the front side of the wafer; and
drying the wafer.