Patent Assignment
Reel/Frame 016500/0318
Intellectual Property Security Agreement
Recorded: 2005-09-07
Received: 2005-09-07
Pages: 8
Assignor
STRASBAUGH
Executed: 2005-08-07
Assignee
AGILITY CAPITAL, LLC
226 E. CANON PERDIDO STREET, SUITE F, SANTA BARBARA, CA, 93101, UNITED STATES
Covered Properties
(19)
System for Loading and Unloading Fluid Products
Application:
10/796,535 →
Devices and Methods for Optical Endpoint Detection During Semiconductor Wafer Polishing
Application:
10/754,360 →
Method of Backgrinding Wafers While Leaving Backgrinding Tape on a Chuck
Application:
10/717,032 →
Retaining Ring for Wafer Carriers
Application:
10/680,995 →
Slurry Pump Control System
Application:
10/626,490 →
Wafer Carrier Pivot Mechanism
Application:
10/425,896 →
Protection of Work Piece During Surface Processing
Application:
10/249,433 →
Subaperture Chemical Mechanical Planarization with Polishing Pad Conditioning
Application:
10/374,494 →
Device for Supporting Thin Semiconductor Wafers
Application:
10/365,081 →
Modular Method for Chemical Mechanical Planarization
Application:
10/327,712 →
Coupler for Coupling an Accessory to a Dipper Arm and a Control System for Such a Coupler
Application:
10/313,576 →
Endpoint Detection System for Wafer Polishing
Application:
10/303,621 →
Method of Preparing Whole Semiconductor Wafer for Analysis
Application:
10/065,589 →
Method for Applying an Insert or Tape to Chucks or Wafer Carriers Used for Grinding, Polishing, or Planarizing Wafers
Application:
10/259,536 →
Polishing Pad Sensor Assembly with a Damping Pad
Application:
10/216,107 →
Polishing Pad with Optical Sensor
Application:
10/146,494 →
Method for Making a Polishing Pad with Built-in Optical Sensor
Application:
10/145,332 →
Method of Spin Etching Wafers with an Alkali Solution
Application:
10/059,701 →
Polishing Pad with Built-in Optical Sensor
Application:
09/970,252 →