Patent Assignment
Reel/Frame 026006/0750
Assignment of Assignor's Interest
Recorded: 2011-03-23
Pages: 40
Assignor
LAM RESEARCH CORPORATION
Executed: 2008-01-08
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(22)
Wafer-Handling Apparatus Having a Resillent Membrane Which Holds Water When a Vacum Is Applied
Patent:
5,423,716 →
Application:
08/178,530 →
Wafer Carrier for Film Planarization
Patent:
5,449,316 →
Application:
08/178,531 →
Parallel Alignment Method and Apparatus for Chemical Mechanical Polishing
Patent:
6,354,926 →
Application:
09/038,875 →
Apparatus for Sensing the Presence of a Wafer
Patent:
5,961,169 →
Application:
09/124,160 →
Accurate Positioning of a Wafer
Patent:
6,131,589 →
Application:
09/247,106 →
Non-Contacting Support for a Wafer
Patent:
6,283,827 →
Application:
09/247,107 →
Sensing the Presence of a Wafer
Patent:
6,267,642 →
Application:
09/247,108 →
Lifting and Rinsing a Wafer
Patent:
6,102,057 →
Application:
09/247,109 →
Optical View Port for Chemical Mechanical Planarization Endpoint Detection
Patent:
6,146,242 →
Application:
09/330,472 →
Unsupported Chemical Mechanical Polishing Belt
Patent:
6,406,363 →
Application:
09/386,741 →
Method and system for chemical mechanical polishing
Patent:
6,347,977 →
Application:
09/514,416 →
Polishing Pad with Reduced Moisture Absorption
Patent:
6,585,574 →
Application:
09/596,842 →
Lifting and Rinsing a Wafer
Patent:
6,505,635 →
Application:
09/608,618 →
Accurate Positioning of a Wafer
Patent:
6,405,740 →
Application:
09/630,507 →
Infrared End-Point Detection System
Patent:
6,540,587 →
Application:
09/688,013 →
Optical View Port for Chemical Mechanical Planarization Endpoint Detection
Patent:
6,488,568 →
Application:
09/712,825 →
Sensing the Presence of a Wafer
Patent:
6,796,881 →
Application:
09/780,067 →
Composite Polishing Pad for Chemical-Mechanical Polishing
Parallel Alignment Method and Apparatus for Chemical Mechanical Polishing
Unsupported Chemical Mechanical Polishing Belt
System and Method for in-Situ Measuring and Monitoring Cmp Polishing Pad Thickness
Patent:
6,951,503 →
Application:
10/879,654 →
Methods for Reducing Slurry Usage in a Linear Chemical Mechanical Planarization System
Patent:
6,953,391 →
Application:
10/901,678 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.