CMP system with wireless endpoint detection system

1. A CMP system for polishing a wafer, said CMP system comprising:

a platen:

a polishing pad assembly comprising:

a polishing pad comprising a polishing layer and a layer of adhesive;

a sensor assembly disposed within the pad, said sensor assembly being operable to detect a condition of a wafer while said wafer is being polished;

a ribbon cable for connecting the optical sensor to a transceiver for communicating data generated by the sensor assembly;

wherein the ribbon cable and the adhesive layer are substantially the same thickness, and the ribbon cable is disposed in a channel running through the adhesive layer;

a first transceiver mounted on the periphery of the platen, said first transceiver operable to receive data from the sensor assembly and transmit said data to a receiver;

a receiver, located on a non rotating portion of the polishing tool, adapted for communication of data from the sensor assembly through the first transceiver, said receiver operably connected to a control system, said control system programmed to analyze the data from the sensor assembly to determine and report the state of a wafer being polished in the CMP system.

2. A method of manufacturing a polishing pad assembly for use in polishing a wafer on a polishing pad which is secured to a platen, said method comprising the steps of:

providing a polishing pad with a layer of adhesive covering a surface of the polishing pad;

providing a sensor assembly having a thickness not exceeding the thickness of the polishing pad;

providing a ribbon cable adapted for connection to the sensor assembly

cutting a hole in the polishing pad to accommodate the sensor assembly within the thickness of the pad;

creating a channel in the layer of adhesive;

fixing the ribbon cable to the sensor assembly;

laying the polishing pad on a platen with the layer of adhesive contacting the platen and the ribbon cable disposed within the channel;

securing a transceiver and power supply to the platen, and connecting the ribbon cable to the transceiver and power supply.

3. A method of manufacturing a polishing pad assembly for use in polishing a wafer on a polishing pad which is secured to a platen, said method comprising the steps of:

providing a polishing pad with a layer of adhesive covering a surface of the polishing pad;

providing a sub-pad with a layer of adhesive covering a surface of the sub-pad;

providing a sensor assembly having a thickness not exceeding the thickness of the polishing pad;

providing a ribbon cable adapted for connection to the sensor assembly

cutting a hole in the polishing pad to accommodate a first portion of sensor assembly;

cutting a hole in the polishing pad to accommodate a second portion of sensor assembly;

creating a channel in the layer of adhesive covering one of the polishing pad and sub-pad;

placing the sensor assembly into the holes in the polishing pad and sub-pad;

fixing the ribbon cable to the sensor assembly;

laying the sub-pad on a platen with the layer of adhesive contacting the platen, and laying the polishing pad over the sub-pad with the layer of adhesive contacting the sub-pad, with the ribbon cable disposed within the channel;

securing a transceiver and power supply to the platen, and connecting the ribbon cable to the transceiver and power supply.