Endpoint detection system for wafer polishing
View Patent ↗An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.
1. A polishing pad assembly for polishing a wafer surface and collecting and transmitting data relating to the condition of the wafer surface, said polishing pad assembly comprising:
a polishing pad;
means for directing light at the wafer surface, said means disposed within the polishing pad;
means for detecting light reflected from the wafer surface and creating an electrical signal corresponding to the light reflected, said means for detecting light disposed within the polishing pad;
means for processing the electrical signal corresponding to the light reflected and producing a corresponding processed signal, said means for processing the electrical signal disposed within the pad; and
a transmitter for transmitting the processed signal, said transmitter operably coupled to the means for processing the electrical signal.
2. The polishing pad assembly of claim 1 wherein the transmitter comprises a radio frequency transmitter.
3. The polishing pad assembly of claim 1 wherein the transmitter comprises a means for transmitting an optical signal.
4. The polishing pad assembly of claim 1 wherein the transmitter comprises a means for transmitting sound waves.
5. The polishing pad assembly of claim 2 wherein the means for directing light and the means for detecting light are encapsulated within a thin disk.
6. The polishing pad assembly of claim 3 wherein the means for directing light and the means for detecting light are encapsulated within a thin disk.
7. The polishing pad assembly of claim 4 wherein the means for directing light and the means for detecting light are encapsulated within a thin disk.
8. The polishing pad assembly of claim 2 further comprising a battery in electrical communication with the means for directing light at the wafer surface.
9. The polishing pad assembly of claim 3 further comprising a battery in electrical communication with the means for directing light at the wafer surface.
10. The polishing pad assembly of claim 4 further comprising a battery in electrical communication with the means for directing light at the wafer surface.
11. The polishing pad assembly of claim 2 further comprising an inductor in electrical communication with the means for directing light at the wafer surface.
12. The polishing pad assembly of claim 3 further comprising an inductor in electrical communication with the means for directing light at the wafer surface.
13. The polishing pad assembly of claim 4 further comprising an inductor in electrical communication with the means for directing light at the wafer surface.
14. A system for polishing wafers and determining the endpoint of certain polishing procedures, where a polishing pad is secured to a platen, and the platen and polishing pad are rotated, and a surface of a wafer is held against a polishing area of the polishing pad to effect polishing of the surface, and at least a portion of the polishing pad is not used for polishing, said system comprising:
a polishing pad having an optical window disposed on the pad, in the polishing area;
a sensor disposed within the optical window, said sensor adapted to detect an optical characteristic of the wafer surface, said optical sensor being operable to output an electrical signal corresponding to the optical characteristic of the wafer surface; and
an optical coupling system operable to optically transfer electrical signals from the sensor during rotation of the polishing pad, said optical coupling system comprising a transmitter for transmitting a light signal output secured to the pad and a detector in optical communication with the transmitter to receive the light signal output.
15. The system of claim 14 wherein the sensor provides a current output proportional to an optical characteristic of the wafer surface and the optical coupling system further comprises means for converting the current output of the optical sensor into an electrical input to the transmitter.
16. The system of claim 14 further comprising:
a light source disposed within the polishing pad for illuminating the wafer surface to provide reflected light to the optical sensor; wherein the optical sensor provides an output corresponding to the intensity of reflected light from the wafer surface.
17. The system of claim 14 , wherein the sensor is disposed off center in the polishing pad, and the transmitter is secured to the center of the pad.
18. The system of claim 14 , further comprising;
a hub disposed at the center of the polishing pad, said hub housing an LED, wherein the detector is suspended over the hub such that the detector is held in operable proximity to the transmitter.
19. A polishing pad assembly for polishing a wafer surface and collecting and transmitting data relating to the condition of the wafer surface, said polishing pad assembly comprising:
a polishing pad;
means for directing light at the wafer surface, said means disposed within the polishing pad;
means for detecting light reflected from the wafer surface and creating an electrical signal corresponding to the light reflected, said means for detecting light disposed within the polishing pad;
means for processing the electrical signal corresponding to the light reflected and producing a time-varying electrical signal corresponding to the light reflected;
means for transmitting the time-varying electrical signal corresponding to the light reflected, said means for transmitting placed in electrical communication with the means for processing; and
means for receiving the the time-varying electrical signal.