Polishing pad with built-in optical sensor
View Patent ↗An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.
1. A polishing pad assembly for use in a CMP process using a sensor assembly to detect the progress of the CMP process, said polishing pad assembly comprising:
a pad having a center;
a releasable mating structure disposed at the center of the pad, said releasable mating structure having a first set of electrical contacts disposed thereon;
sensor assembly disposed within the pad, said sensor assembly radially spaced from the center of the pad; and
an electrical conductor connecting the sensor assembly to the releasable rotating mating structure; and
a hub adapted to be releasably attached to the releasable mating structure, said hub having a second set of electrical contacts disposed thereon such that insertion of the hub into the releasable fitting results in electrical contact between the first set of electrical contacts and the second set of electrical contacts;
wherein the releasable mating structure further comprises a snap ring assembly disposed in the center of the polishing pad, said snap ring assembly having snap ring and a hub receiving aperture, said hub, receiving aperture having a bottom;
a contact pad disposed on the bottom of the hub receiving aperture, wherein the first set of electrical contacts are disposed on the contact pad, and wherein said contacts face towards the hub receiving aperture; and
the electrical conductor electrically connects the sensor assembly to the plurality of electrical contacts on the bottom of the snap ring.
2. The polishing pad of claim 1 wherein the top surface of the snap ring and the top surface of the pad are substantially co-planar and wherein the bottom surface of the snap ring and the bottom surface of the pad are substantially co-planar.
3. The polishing pad of claim 1 where the removably attachable hub is an electronics hub holding electronics.
4. The polishing pad of claim 1 wherein the first set of contacts comprises a signal contact, a power contact, and a ground contact, and the removably attached hub is an electronics hub holding electronics for processing a signal received from the signal contact, for transferring power to the power contact, and for connecting a common ground to the ground contact.