Sealing device for a surface
View Patent ↗A sealing device for a well plate and process for fabrication of the device. The device includes a first layer and two adhesive layers. A bore is formed through the first layer and the two adhesive layers. A translucent second layer adheres to the first adhesive layer of the first layer to seal the well plate. The process for fabricating a sealing device provides a first layer with a first side having a first adhesive layer and a second side having a second adhesive layer. A second layer adheres to the first adhesive layer. A bore is formed through the first layer, first adhesive layer, second adhesive layer, and second layer, after removal of the second layer from the first adhesive layer. Yet another layer adheres to the first adhesive layer over the bore. A coloration element may be added to the device.
1. A process for fabricating a sealing device for a well plate,
comprising:
a. providing a first layer having a first side and a second side;
b. locating a first adhesive layer to said first side of said first layer;
c. locating a second adhesive to said second side of said first layer, said second adhesive being capable of adhering to the well plate;
d. providing a second layer to adhere to said first adhesive layer of said first side of said first layer;
e. forming a bore through said first layer, first adhesive layer, second adhesive layer and said second layer;
f. removing said entire second layer from said first adhesive layer;
g. providing yet another layer to adhere to said first adhesive layer and to overlie said bore through said first adhesive layer, said first layer, and said second adhesive layer;
h. selectively providing a coloration element at said first layer, said first adhesive layer, and said second adhesive layer simultaneously with said steps of locating a first adhesive layer to said first side of said first layer and providing a first layer having a first side and a second side.
2. The process of claim 1 which said second layer is formed of translucent material.
3. The process of claim 1 which additionally comprises the step of adhering said second adhesive layer to the well plate.