ADHESIVE FILM
An adhesive film is provided that can ensure reliable continuity even if a filler and a binder composition are not sufficiently removed from between a wiring board and a semiconductor chip during flip-chip mounting of the semiconductor chip. The adhesive film is formed from a binder composition including an epoxy compound, a curing agent, and the filler. The amount of a filler contained with respect to a total amount of an epoxy compound, a curing agent, and the filler is 10 to 70 mass %. The filler includes first non-conductive inorganic particles having an average particle size of 0.5 to 1.0 μm, and conductive particles formed by subjecting second non-conductive inorganic particles having an average particle size of 0.5 to 1.0 μm. An average particle size of the conductive particles does not exceed 1.5 μm. The conductive particles is contained in an amount of 10 to 60 mass % of the filler.
1 . An adhesive film comprising a binder composition including an epoxy compound, a curing agent, and a filler, for flip-chip mounting a semiconductor chip having a bump on a wiring board, wherein
an amount of the filler is 10 to 70 mass % with respect to a total amount of the epoxy compound, the curing agent, and the filler,
the filler includes a first non-conductive inorganic particle having an average particle size of 0.5 to 1.0 μm, and a conductive particle formed by subjecting a second non-conductive inorganic particle having an average particle size of 0.5 to 1.0 μm to an electroless plating treatment so that an average particle size of the conductive particle does not exceed 1.5 μm, and
the conductive particle is contained in an amount of 10 to 60 mass % of the filler.
2 . The adhesive film according to claim 1 , wherein the first and second non-conductive inorganic particles are any of a silica fine particle, an alumina particle and a titanium dioxide particle.
3 . The adhesive film according to claim 1 , wherein the average particle size of the first and second non-conductive inorganic particles is 0.5 to 0.8 μm.
4 . The adhesive film according to claim 1 , wherein the particle size of the conductive particle is 1.1 μm or less.
5 . The adhesive film according to claim 1 , wherein the average particle size of the conductive particle is 1.0 to 2.0 times the average particle size of the first non-conductive inorganic particle.
6 . The adhesive film according to claim 1 , wherein a metal type for use in the electroless plating treatment is any of gold, nickel, nickel/gold, and solder.
7 . A connected structure formed with a semiconductor chip having a bump connected and fixed to a wiring board via the adhesive film according to claim 1 .
8 . The connected structure according to claim 7 , wherein the bump of the semiconductor chip and a bump of the wiring board are connected to each other.