IP Library Granted Patent US 8,395,083
Granted Patent B2
US 8,395,083 · App. 12/812,073 · Granted Mar 12, 2013

Multiple beam drilling system

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Quick Facts
Patent No.
US 8,395,083
App. No.
12/812,073
Granted
Mar 12, 2013
Kind
B2
Abstract

A method for laser drilling of holes in a substrate ( 44 ) with varying simultaneity including operating a laser ( 22 ) to produce a single output beam ( 24 ) whose pulses have a total energy, dividing the single output beam into plural beams ( 41 ) to an extent which varies over time and applying the plural beams to plural hole drilling locations ( 209, 210, 212, 214, 216, 218, 220, 222 ) on the substrate including simultaneously drilling first parts of multiple holes using corresponding ones of the plural beams having a pulse energy which is a first fraction of the total energy and thereafter drilling at least one second part of at least one of the multiple holes using at least one of the plural beams each having a pulse energy which is at least a second fraction of the total energy, the second fraction being different from the first fraction.

Claims (21)

1. A method for laser drilling of holes in a substrate with varying simultaneity comprising:

operating a laser to produce a single output beam whose pulses have a total energy;

dividing said single output beam into plural beams to an extent which varies over time; and

applying said plural beams to plural hole drilling locations on said substrate including:

simultaneously drilling first parts of multiple holes using corresponding ones of said plural beams having a pulse energy which is a first fraction of said total energy; and

thereafter drilling at least one second part of at least one of said multiple holes using at least one of said plural beams each having a pulse energy which is at least a second fraction of said total energy, said second fraction being different from said first fraction.

2. A method according to claim 1 and wherein said first fraction is a function of the number of said multiple holes.

3. A method according to claim 1 and wherein said second fraction is a function of the number of said multiple holes having said at least one second part being drilled.

4. A method for laser drilling of holes in a substrate with varying simultaneity comprising:

operating a laser to produce a single output beam having a total power;

dividing said single output beam into plural beams to an extent which varies over time; and

applying said plural beams to plural hole drilling locations on said substrate including:

simultaneously drilling first parts of multiple holes using corresponding ones of said plural beams having a beam power which is a first fraction of said total power; and

thereafter drilling at least one second part of at least one of said multiple holes using at least one of said plural beams each having a beam power which is at least a second fraction of said total power, said second fraction being different from said first fraction.

5. A method according to claim 4 and wherein said first fraction is a function of the number of said multiple holes.

6. A method according to claim 4 and wherein said second fraction is a function of the number of said multiple holes having said at least one second part being drilled.

7. A method according to claim 4 and wherein said single output beam comprises pulses having single beam pulse energies generated at a pulse repetition rate, and wherein said ones of said plural beams drilling first parts of multiple holes comprise pulses having said pulse repetition rate and pulse energies which are said first fraction of said single beam pulse energies.

8. A method according to claim 7 and wherein said at least one of said plural beams drilling at least one second part of at least one of said multiple holes comprise pulses having said pulse repetition rate and pulse energies which are at least said second fraction of said single beam pulse energies.

9. A method according to claim 7 and wherein said at least one of said plural beams drilling at least one second part of at least one of said multiple holes comprise pulses having a sub-multiple of said pulse repetition rate and pulse energies which are a function of said single beam pulse energies, wherein said sub-multiple and said function are selected in response to said second fraction.

10. A method according to claim 4 and wherein said single output beam comprises pulses having single beam pulse energies generated at a pulse repetition rate, and wherein said ones of said plural beams drilling first parts of multiple holes comprise pulses having a first sub-multiple of said pulse repetition rate selected in response to said first fraction and pulse energies which are a first function of said single beam pulse energies.

11. A method according to claim 10 and wherein said at least one of said plural beams drilling at least one second part of at least one of said multiple holes comprise pulses having a second sub-multiple of said pulse repetition rate and pulse energies which are a second function of said single beam pulse energies, said second sub-multiple and said second function being selected in response to said second fraction.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Jul 5, 2016
From: JPMORGAN CHASE BANK, N.A.
To: ORBOTECH LIMITED
Reel/Frame 039256/0711 →
PATENT SECURITY AGREEMENT Recorded Mar 7, 2016
From: ORBOTECH LTD.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 038021/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2010
From: NAVEH, BENNY; KOTLER, ZVI; GOLAN, HANINA
To: ORBOTECH LTD
Reel/Frame 024650/0851 →