Surface inspection method and surface inspection apparatus
View Patent ↗A surface inspection method and a surface inspection apparatus in which a plurality of photodetectors are arranged in a plurality of directions so that light scattered, diffracted or reflected on a surface of an object to be inspected or in the vicinity of the surface is detected and a plurality of signals obtained by this are subjected to weighted addition processing or weighted averaging processing by linear combination.
1. An inspection apparatus, which inspects a substrate anomaly, comprising:
an irradiation unit, which irradiates said substrate with light;
a first detection unit, which detects light from said substrate, and generates a first signal; and
a processing unit, which calculates a first weighting factor based on a DC component of said first signal, and multiplies said first weighting factor by a pulse component of said signal, and determines said anomaly based on a result of said multiplication.
2. An inspection apparatus according to claim 1 ,
wherein said processing unit divides said first signal into said DC component and said pulse component.
3. An inspection apparatus according to claim 1 ,
wherein said first weighting factor corresponds to an inverse of said DC component.
4. An inspection apparatus according to claim 3 ,
wherein said first weighting factor is represented as a result of multiplying a proportionality component by said inverse.
5. A method for inspecting a substrate anomaly comprising:
irradiating said substrate with a first light;
detecting a second light reflected from said substrate and generating a first signal;
calculating a first weighting factor based on a DC component of said first signal;
multiplying said first weighting factor by a pulse component of said datum first signal; and
determining an existence of said anomaly based on a result of said multiplication.
6. The method of claim 5 further comprising dividing said first signal into said DC component and said pulse component.
7. The method of claim 5 , wherein said first weighting factor corresponds to an inverse of said DC component.
8. The method of claim 7 , wherein said first weighting factor is represented as a result of multiplying a proportionality component by said inverse.
9. A process which inspects a substrate anomaly, comprising:
irradiating said substrate with light;
detecting light from said substrate, and generating a first signal; and
calculating a weighting factor based on a DC component of said first signal, multiplying said weighting factor by a pulse component of said signal, and determining said anomaly based on a result of said multiplication.
10. A process according to claim 9 ,
wherein said first signal is divided into said DC component and said pulse component.
11. A process according to claim 9 ,
wherein said weighting factor corresponds to an inverse of said DC component.
12. A process according to claim 11 ,
wherein said weighting factor is represented as a result of multiplying a proportionality constant by said inverse.
13. The inspection apparatus according to claim 1 , wherein said processing unit acquires size of said anomaly by using a calibration-curve and said first weighting factor.
14. The inspection apparatus according to claim 13 , wherein said calibration-curve expresses a relationship between light from a standard object and said pulse component.
15. The inspection apparatus according to claim 1 further comprising:
a second detection unit arranged at different position relative to the position in which said first detection unit is arranged;
wherein said second detection unit detects light from said substrate, and generates a second signal;
wherein said processing unit which calculates a second weighting factor based on a DC component of said second signal, multiplies said second weighting factor by a pulse component of said second signal, and determines said anomaly based on a result of said multiplying said second weighting factor by a pulse component of said second signal.
16. The inspection apparatus according to claim 15 ,
wherein said processing unit acquires a first size of said anomaly by using a second calibration-curve and said second weighting factor.
17. The method for inspecting a substrate anomaly according to claim 5 ,
wherein a size of said anomaly is acquired by using a calibration-curve and said first weighting factor.
18. The method for inspecting a substrate anomaly according to claim 5 ,
wherein said calibration-curve expresses a relationship between light from a standard object and said pulse component of said first signal.
19. The method for inspecting a substrate anomaly according to claim 5 further comprising:
detecting a second light from said substrate, and generating a second signal;
calculating a second weighting factor based on a continuous component of said second signal, multiplies said second weighting factor by a pulse component of said second signal, and determines said anomaly based on a result of said multiplying said second weighting factor by a pulse component of said second signal.
20. The method for inspecting a substrate anomaly according to claim 19 , acquiring first size of said anomaly by using a second calibration-curve and said second weighting factor.