Semiconductor device
On the top surface of a thin semiconductor wafer, top surface structures forming a semiconductor chip are formed. The top surface of the wafer is affixed to a supporting substrate with a double-sided adhesive tape. Then, from the bottom surface of the thin semiconductor wafer, a trench, which becomes a scribing line, is formed by wet anisotropic etching so that side walls of the trench are exposed. On the side walls of the trench with the crystal face exposed, an isolation layer with a conductivity type different from that of the semiconductor wafer for holding a reverse breakdown voltage is formed simultaneously with a collector region of the bottom surface diffused layer by ion implantation, followed by annealing with laser irradiation. The side walls form a substantially V-shaped or trapezoidal-shaped cross section, with an angle of the side wall relative to the supporting substrate being 30-70°. The double-sided adhesive tape is then removed from the top surface to produce semiconductor chips. With such a manufacturing method, a reverse-blocking semiconductor device having high reliability can be formed.
1. A semiconductor device comprising:
a first conductivity type substrate with a first principle surface on which an active device is formed and a second principle surface with a collector diffused layer on the second principle surface;
a trench in the second principle surface;
a second conductivity type doped semiconductor layer on the trench; and
a second conductivity type layer on the second principle surface, the second conductivity type layer being coupled to the second conductivity type doped semiconductor layer,
wherein the trench has a substantially trapezoidal-shaped cross section and has side walls that extend from the second principle surface at an incline, the side walls defining the outer circumferential edge of the semiconductor device,
wherein the angle of inclination of the side walls relative to the first principle surface is at least 30° but not greater than 70°.
2. A semiconductor device comprising:
a second conductivity type base region selectively provided in a surface region on a first principal surface of a first conductivity type semiconductor substrate;
a first conductivity type emitter region selectively provided in a surface region of the base region;
a MOS gate structure including:
a gate insulator film provided on a surface of a section of the base region, the section being positioned between the semiconductor substrate and the emitter region; and
a gate electrode provided on the gate insulator film;
an emitter electrode in contact with the emitter region and the base region;
a second conductivity type collector layer provided on a surface of a second principal surface of the semiconductor substrate;
a collector electrode in contact with the collector layer; and
a second conductivity type isolation layer surrounding the MOS gate structure, extending to the first principal surface from the second principal surface while being inclined to the first principal surface, and coupled to the collector layer,
wherein the isolation layer is covered with the collector electrode, and
wherein each of the first principal surface and the second principal surface is a {100} plane, the isolation layer is an impurity layer formed by introducing a second conductivity type impurity into a side wall of a {111} plane of a trench formed in the semiconductor substrate from the second principal surface, and the second conductivity type isolation layer has an angle of inclination of 125.3° on the second principal surface side.