IP Library Granted Patent US 8,248,742
Granted Patent B2
US 8,248,742 · App. 12/824,719 · Granted Aug 21, 2012

Semiconductor device

Assignee: Renesas Electronics Corporation
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Quick Facts
Patent No.
US 8,248,742
App. No.
12/824,719
Granted
Aug 21, 2012
Kind
B2
Abstract

A semiconductor device has: a power supply line; a ground line; a signal line for transmitting a signal; a signal pad connected to the signal line; a protection element connected between the signal line and the ground line; and a trigger circuit configured to supply a trigger current to the protection element. The trigger circuit has: a PMOS transistor whose gate and backgate are connected to the power supply line and whose source is connected to the protection element; and an amplifier circuit part configured to amplify a first current flowing through the PMOS transistor to generate a second current. The trigger current includes the second current.

Claims (33)

1. A semiconductor device comprising:

a power supply line;

a ground line;

a signal line for transmitting a signal;

a signal pad connected to said signal line;

a protection element connected between said signal line and said ground line; and

a trigger circuit configured to supply a trigger current to said protection element,

wherein said trigger circuit comprises:

a PMOS transistor whose gate and backgate are connected to said power supply line and whose source is connected to said protection element; and

an amplifier circuit part configured to amplify a first current flowing through said PMOS transistor to generate a second current,

wherein said trigger current includes said second current.

2. The semiconductor device according to claim 1 ,

wherein said amplifier circuit part of said trigger circuit comprises:

a first node connected to a drain of said PMOS transistor;

a first resistor element connected between said first node and said ground line; and

a first NMOS transistor whose drain is connected to said protection element, whose source is connected to said ground line and whose gate is connected to said first node.

3. The semiconductor device according to claim 2 ,

wherein said amplifier circuit part further comprises:

a second node connected to said gate of said PMOS transistor;

a second resistor element connected between said second node and said power supply line; and

a switch element configured to provide, in response to potential of said first node, a current path between said second node and said ground line.

4. The semiconductor device according to claim 3 ,

wherein said switch element comprises a second NMOS transistor whose drain is connected to said second node, whose gate is connected to said first node and whose source is connected to said ground line.

5. The semiconductor device according to claim 1 ,

wherein a parasitic diode or a diode element is connected between said signal line and said power supply line.

6. The semiconductor device according to claim 1 ,

wherein said protection element is a thyristor.

7. The semiconductor device according to claim 1 ,

wherein said PMOS transistor does not perform a parasitic bipolar operation when generating said first current.

8. The semiconductor device according to claim 2 ,

wherein said first NMOS transistor does not perform a parasitic bipolar operation when generating said second current.

9. The semiconductor device according to claim 4 ,

wherein said second NMOS transistor does not perform a parasitic bipolar operation when providing said current path.

Assignments (2)
CHANGE OF NAME Recorded Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025191/0916 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2010
From: OKUSHIMA, MOTOTSUGU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024607/0865 →
Priority Claims (1)
JP 2009-172562 · Jul 23, 2009 · national
Continuity (1)
Related Publication 20110019319A1 · Jan 27, 2011