IP Library Patent Application 12825946
Patent Application
App. No. 12/825,946

SEMICONDUCTOR LIGHT RECEIVING DEVICE

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Quick Facts
Patent No.
US None
App. No.
12/825,946
Abstract

According to an exemplary aspect of the present invention, at least a semiconductor mesa and a semiconductor layer covering at least the side wall of the mesa and a semiconductor mesa are formed on an n-type semiconductor substrate. The semiconductor mesa includes at least a light absorption layer and a p-type contact layer. The principal surface of the semiconductor substrate tilts at an angle θ to the (100) plane. The angle θ is 0.1 degree≦|θ|≦10 degrees.

Claims (17)

1 . a semiconductor light receiving device comprising:

a semiconductor substrate having a first conductivity type;

a semiconductor mesa arranged over the semiconductor substrate; and

a first semiconductor layer covering at least a side wall of the semiconductor mesa, wherein

the semiconductor mesa comprises:

a light absorption layer; and

a second semiconductor layer that is arranged over the light absorption layer and has a second conductivity type opposite to the first conductivity type,

the principal surface of the semiconductor substrate tilts at an angle θ to a (100) plane by using [01-1] direction as an axis, and

the angle θ is 0.1 degree≦|θ|≦10 degrees.

2 . The semiconductor light receiving device according to claim 1 , wherein the angle θ is 0.1 degree≦|θ|≦2 degrees.

3 . The semiconductor light receiving device according to claim 1 , wherein the angle |θ| substantially equals 1 degree.

4 . The semiconductor light receiving device according to claim 1 , wherein

the light absorption layer is made of intrinsic semiconductor, and

the semiconductor light receiving device is a PIN photodiode.

5 . The semiconductor light receiving device according to claim 1 , wherein

the light absorption layer is made of semiconductor having the first type conductivity or the second type conductivity, and

the semiconductor light receiving device is an avalanche photodiode.

Assignments (2)
CHANGE OF NAME Recorded Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025191/0916 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2010
From: MATSUMOTO, TAKASHI; WATANABE, ISAO; KOI, TOMOAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024610/0029 →