SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR TESTING THE SAME

1 . A semiconductor integrated circuit device, comprising:

first and second terminals;

first to (2n+1)-th resistive elements (n is an integer of at least 1) connected in series between the first and second terminals;

a selection circuit selecting, assuming that a first terminal connected to one end of the first resistive element is a 0th node, a second terminal connected to the other end of the (2n+1)-th resistive element is a (2n+1)-th node, and a connection point of the other end of an i-th resistive element (i is an integer from 1 to 2n) and one end of an (i+1)-th resistive element is an i-th node, any one of the 0th to (2n+1)-th nodes and outputting a voltage applied to the selected node;

a first switch group capable of shorting any 2k-th node (k is an integer from 0 to n); and

a second switch group capable of shorting any (2k+1)-th node.

2 . The semiconductor integrated circuit device according to claim 1 , wherein the first and second switch groups are open in a normal operation mode and are temporarily shorted in a test mode.

3 . The semiconductor integrated circuit device according to claim 1 , further comprising a plurality of the selection circuits, wherein wirings, each extending from a corresponding one of the 0th to (2n+1)-th nodes, extend in parallel to each other to branch points of the plurality of selection circuits.

4 . The semiconductor integrated circuit device according to claim 3 , wherein the plurality of the selection circuits are arranged under a plurality of wiring arrangement regions in output cell arrangement regions.

5 . A method for testing a semiconductor integrated circuit device comprising:

first and second terminals and first to (2n+1)-th resistive elements (n is an integer of at least 1) connected in series between the first and second terminals and capable of selecting, assuming that a first terminal connected to one end of a first resistive element is a 0th node, a second terminal connected to the other end of the (2n+1)-th resistive element is a (2n+1)-th node, and a connection point of the other end of an i-th resistive element (i is an integer from 1 to 2n) and one end of an (i+1)-th resistive element is an i-th node, any one of the 0th to (2n+1)-th nodes and outputting a voltage applied to the selected node, the method comprising:

(a) shorting any 2k-th node (k is an integer from 0 to n), that is, all the even-numbered nodes and any (2k+1)-th node, that is, all the odd-numbered nodes, termed “step (a)”;

(b) temporarily applying a predetermined voltage between the first and second terminals, termed “step (b)”; and

(c) opening any 2k-th node, that is, all the even-numbered nodes and any (2k+1)-th node, that is, all the odd-numbered nodes, termed “step (c)”.

6 . The method for testing the semiconductor integrated circuit device according to claim 5 , further comprising (d) measuring electrical characteristics of the first to (2n+1)-th resistive elements after step (c), termed “step (d)”.

7 . The method for testing the semiconductor integrated circuit device according to claim 6 , further comprising:

(a0) measuring initial electrical characteristics of the first to (2n+1)-th resistive elements before step (a), termed “step (a0)”; and

(e) comparing measurement results of the electrical characteristics obtained in steps (a0) and (d) after step (d), termed “step (e)”.