DECORATION FILM, DECORATION DEVICE, AND METHOD FOR MANUFACTURING DECORATION DEVICE
A decoration film, a decoration device and a method for manufacturing a decoration device are provided. The decoration film includes a substrate, a releasing layer, a pattern layer and an adhesion layer. The releasing layer is disposed on the substrate. The pattern layer is disposed on the releasing layer at a side far from the substrate. The adhesion layer is disposed on a portion of the pattern layer.
1 . A decoration film, comprising:
a substrate;
a releasing layer disposed on the substrate;
a pattern layer disposed on the releasing layer at a side far from the substrate; and
an adhesion layer disposed on a portion of the pattern layer.
2 . The decoration film as claimed in claim 1 , further comprising a durable layer disposed on the releasing layer and located between the releasing layer and the pattern layer.
3 . The decoration film as claimed in claim 2 , wherein the durable layer has a thickness of at least 5 μm.
4 . The decoration film as claimed in claim 1 , wherein the adhesion layer has a thickness of at least 5 μm.
5 . The decoration film as claimed in claim 1 , wherein the pattern layer has a thickness of at least 1 μm.
6 . A decoration device, comprising:
a body having an outer surface; and
a decoration film disposed on a portion of the outer surface of the body, wherein the decoration film comprises:
a pattern layer disposed above the portion of the outer surface; and
an adhesion layer disposed between the outer surface of the body and the pattern layer, wherein the adhesion layer is conformally to the pattern layer.
7 . The decoration device as claimed in claim 6 , wherein the decoration film further comprises:
a durable layer disposed on the pattern layer and being exposed, wherein the durable layer is conformed to the pattern layer.
8 . The decoration device as claimed in claim 7 , wherein the durable layer has a thickness of at least 5 μm.
9 . The decoration device as claimed in claim 6 , wherein the adhesion layer has a thickness of at least 5 μm.
10 . The decoration device as claimed in claim 6 , wherein the pattern layer has a thickness of at least 1 μm.
11 . A method for manufacturing a decoration device, comprising:
providing a substrate having a releasing layer formed thereon;
forming a pattern layer on the releasing layer at a side far from the substrate;
forming an adhesion layer on a portion of the pattern layer, wherein a decoration film is defined by the substrate, the releasing layer, the pattern layer and the adhesion layer; and
forming a body on the adhesion layer so as to closely attach the body to the adhesion layer.
12 . The method for manufacturing the decoration device as claimed in claim 11 , wherein a method of forming the body comprises:
disposing a plastic material on the adhesion layer at a side far from the pattern layer; and
curing the plastic material to form the body so that the decoration film is closely attached to the body by the adhesion layer.
13 . The method for manufacturing the decoration device as claimed in claim 12 , wherein the plastic material is selected from the group consisting of polycarbonate, polypropylene, polyacrylate, styrene-methyl methacrylate copolymer, acrylonitrile butadiene styrene, polystyrene, polyethylene terephthalate, polyoxymethylene and combinations thereof.
14 . The method for manufacturing the decoration device as claimed in claim 11 , wherein a method for attaching the body to the adhesion layer closely comprises:
disposing the decoration film on the body;
performing a heat transfer printing process to the decoration film;
disposing the decoration film and the body in a chamber; and
extracting air from the chamber, so that the decoration film is closely attached to the body by the adhesion layer.
15 . The method for manufacturing the decoration device as claimed in claim 14 , wherein the heat transfer printing process comprises a heating process and a pressing process.
16 . The method for manufacturing the decoration device as claimed in claim 11 , wherein before the pattern layer is formed, the method further comprises:
forming a durable layer on the releasing layer.
17 . The method for manufacturing the decoration device as claimed in claim 16 , wherein the durable layer has a thickness of at least 5 μm.
18 . The method for manufacturing the decoration device as claimed in claim 11 , wherein after the body is formed, the method further comprises:
removing the substrate and the releasing layer thereon from the body by applying a release force.
19 . The method for manufacturing the decoration device as claimed in claim 11 , wherein the adhesion layer has a thickness of at least 5 μm.
20 . The method for manufacturing the decoration device as claimed in claim 11 , wherein the pattern layer has a thickness of at least 1 μm.