DECORATION FILM, DECORATION DEVICE AND METHOD FOR FABRICATING DECORATION FILM
A decoration film, a decoration device, and a method for fabricating the decoration film are provided. The decoration film includes a substrate, an adhesion layer disposed on the substrate, and a metal layer with low conductivity disposed between the substrate and the adhesion layer, wherein an electromagnetic wave passes through the metal layer with low conductivity without being completely shielded.
1 . A decoration film comprising:
a substrate;
an adhesion layer disposed on the substrate; and
a metal layer with low conductivity disposed between the substrate and the adhesion layer, wherein an electromagnetic wave passes through the metal layer with low conductivity without being completely shielded.
2 . The decoration film according to claim 1 , further comprising a releasing layer disposed between the metal layer with low conductivity and the substrate, wherein the releasing layer contacts the substrate.
3 . The decoration film according to claim 1 , wherein a material of the metal layer with low conductivity comprises a material with metallic gloss and a dopant material.
4 . The decoration film according to claim 3 , wherein the material with metallic gloss is selected from Sn, Cr, Ti, Ni, Zn, Mo Al, Au, Ag, Cu, or a combination thereof.
5 . The decoration film according to claim 3 , wherein the dopant material is selected from In, Sn, Au, Ag, Cu, Co, W, Al, Cr, Ni, Zr, Zn, Pt, Pd, Mo, TiO 2 , TiO x , ZrO, SiO 2 , or a combination thereof.
6 . The decoration film according to claim 3 , wherein a color or a gloss of the metal layer with low conductivity is changed along with a material of the dopant material.
7 . The decoration film according to claim 1 , further comprising an ink layer disposed between the substrate and the adhesion layer.
8 . The decoration film according to claim 5 , wherein the ink layer is located between the metal layer with low conductivity and the substrate.
9 . The decoration film according to claim 5 , wherein the ink layer is located between the metal layer with low conductivity and the adhesion layer.
10 . The decoration film according to claim 1 , further comprising an oxide layer disposed on at least a side of the metal layer with low conductivity.
11 . The decoration film according to claim 10 , wherein a material of the oxide layer comprises titanium oxide, zinc oxide, aluminum oxide, indium tin oxide, indium oxide, tin oxide, magnesium oxide, copper oxide, zirconium dioxide, silicon dioxide, or a combination thereof.
12 . A decoration device comprising
a housing;
a metal layer with low conductivity disposed on a surface of the housing, wherein an electromagnetic wave passes through the metal layer with low conductivity without being completely shielded;
an adhesion layer disposed between the housing and the metal layer with low conductivity; and
a outer layer disposed on the metal layer with low conductivity away from the adhesion layer.
13 . The decoration device according to claim 12 , wherein a material of the metal layer with low conductivity comprises a material with metallic gloss and a dopant material.
14 . The decoration device according to claim 13 , wherein the material with metallic gloss is selected from Sn, Cr, Ti, Ni, Zn, Mo Al, Au, Ag, Cu, or a combination thereof.
15 . The decoration device according to claim 13 , wherein the dopant material is selected from In, Sn, Cr, Ti, Ni, Zn, Mo Al, Au, Ag, Cu, TiO 2 , TiO x , ZrO, SiO 2 , or a combination thereof.
16 . The decoration device according to claim 12 , further comprising an ink layer disposed between the outer layer and the adhesion layer.
17 . The decoration device according to claim 16 , wherein the ink layer is located between the metal layer with low conductivity and the outer layer.
18 . The decoration device according to claim 16 , wherein the ink layer is located between the metal layer with low conductivity and the adhesion layer.
19 . The decoration device according to claim 12 , wherein the outer layer is a substrate, a releasing layer, or a protection layer.
20 . The decoration device according to claim 12 , further comprising an oxide layer disposed on at least a side of the metal layer with low conductivity.
21 . The decoration device according to claim 20 , wherein a material of the oxide layer comprises titanium oxide, zinc oxide, aluminum oxide, indium tin oxide, indium oxide, tin oxide, magnesium oxide, copper oxide, zirconium dioxide, silicon dioxide, or a combination thereof.
22 . A method for fabricating the decoration film according to claim 1 , wherein the metal layer with low conductivity is formed by performing an evaporation process or a sputtering process.
23 . The method according to claim 22 , wherein a target material of the evaporation process or the sputtering process comprises a material with metallic gloss and a dopant material.
24 . The method according to claim 23 , wherein the material with metallic gloss is selected from Sn, Cr, Ti, Ni, Zn, Mo Al, Au, Ag, Cu, or a combination thereof.
25 . The method according to claim 23 , wherein the dopant material is selected from In, Sn, Cr, Ti, Ni, Zn, Mo Al, Au, Ag, Cu, TiO 2 , TiO x , ZrO, SiO 2 , or a combination thereof.